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Wolfgang Klingauf

dblp:43/4290 · DBLP profile ↗
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8ranked-venue papers
5as first author
0since 2021 · last 2007
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Software engineering, systems software and programming languages · 6 · 3 first-authorSystems, architecture and hardware · 4 · 4 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 50% Interconnection networks and networks-on-chip · 50%

Topics — the 2 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Interconnection networks and networks-on-chip
on-chip interconnect
0.112006
GreenBus: a generic interconnect fabric for transaction level modelling · DAC 2006
Electronic design automation › system-level design › high-level system modeling
transaction-level modeling
0.112006
GreenBus: a generic interconnect fabric for transaction level modelling · DAC 2006

Methods — techniques the papers use, named apart from their topics

transaction level modelling · 0.1
YearPublicationVenuePosition
2007 Transaction Level Modelling: A reflection on what TLM is and how TLMs may be classified
Mark Burton, James Aldis, Robert Günzel, Wolfgang Klingauf
FDL4
2007 Measuring the Quality of a SystemC Testbench by using Code Coverage Techniques
Daniel Große, Hernan Peraza, Wolfgang Klingauf, Rolf Drechsler
FDL3
2007 Combinatorial Dependencies in Transaction Level Models
Robert Günzel, Wolfgang Klingauf, James Aldis
FDL2
2006 GreenBus: a generic interconnect fabric for transaction level modelling
abstract
In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have analysed, which are common in todays system on chip environments, and require to be modelled at a transaction level. Second our findings in terms of the data structures and interface API's that are required in order to model those (and we believe other) busses and IO structures. Third the surrounding infrastructure that we believe can, and should be in place to support the modelling of those busses and IO structures. We will present the infrastructure that we have built, and indicate where our future work will hea.
Wolfgang Klingauf, Robert Günzel, Oliver Bringmann 0001, Pavel Parfuntseu, Mark Burton
DAC1
2006 TRAIN: a virtual transaction layer architecture for TLM-based HW/SW codesign of synthesizable MPSoC
abstract
Our concept of a virtual transaction layer (VTL) architecture allows to directly map transaction-level communication channels onto a synthesizable multiprocessor SoC implementation. The VTL is above the physical MPSoC communication architecture, acting as a hardware abstraction layer for both HW and SW components. TLM channels are represented by virtual channels which efficiently route transactions between SW and HW entities through the on-chip communication network with respect to quality-of-service and realtime requirements. The goal is to methodically simplify MPSoC design by systematic HW/SW interface abstraction, thus enabling early SW verification, rapid prototyping and fast exploration of critical design issues. With TRAIN, we present our implementation of such a VTL architecture for Virtex-II Pro and PowerPC and illustrate its efficiency by experimentation
Wolfgang Klingauf, Hagen Gädke-Lütjens, Robert Günzel
DATE1
2006 Design Structure Analysis and Transaction Recording in SystemC
Wolfgang Klingauf, Manuel Geffken
FDL1
2005 Systematic Transaction Level Modeling of Embedded Systems with SystemC
abstract
The paper gives an overview of a transaction level modeling (TLM) design flow for straightforward embedded system design with SystemC. The goal is to develop systematically both the HW and SW application-specific components of an embedded system using the TLM approach, thus allowing for fast communication architecture exploration, rapid prototyping and early embedded SW development. To this end, we specify a lightweight transaction-based communication protocol, SHIP (SystemC high-level interface protocol), and present a methodology for automatic mapping of the communication part of a system to a given architecture, including HW/SW interfaces.
Wolfgang Klingauf
DATE1
2005 From TLM to FPGA: Rapid Prototyping with SystemC and Transaction Level Modeling
Wolfgang Klingauf, Robert Günzel
FPT1