In this paper, we propose a process-variability-aware adaptive test flow that realizes efficient and comprehensive detection of parametric faults. A parametric fault is essentially a malfunction in a large-scale integration chip, which is caused by the variability in fabrication processes. In our adaptive test framework, test pattern sets are altered on individual chips in order to apply the optimal set of test patterns for each chip, and thus the test coverage is improved and the test time is reduced. The test pattern is chosen on the basis of parameter estimations measured using an on-chip sensor with respect to statistical timing information. We also propose a novel metric to quantize the test coverage suitable for evaluating the test quality of parametric faults. Our experimental results using an industrial design show that the proposed flow significantly improves the parametric fault coverage and test efficiency compared to conventional test flows.

The continuing miniaturization of LSI dimension is causing the increase of process-related variations which significantly affects not only its design turn around time but also its manufacturing yield. Statistical static timing analysis (SSTA) is expected as a promising way to estimate the performance of circuits more accurately considering delay variations. However, LSIs designed using SSTA may have higher probability of parametric faults than the ones designed with deterministic timing analysis. In order to test these parametric faults, effective extraction techniques of critical paths are needed. In this paper, we discuss a general trend between the delay margin of LSIs designed by SSTA and their parametric fault ratio. Then we propose an adaptive test flow for parametric faults using statistical static timing information, and a concept of parametric fault coverage. Experimental results demonstrate the effectiveness of our approach.

Reducing IR-drop in the test cycle during at-speed scan testing has become mandatory for avoiding test-induced yield loss. An efficient approach for this purpose is post-ATPG test modification based on X-identification and X-filling since it causes no circuit/clock design change and no test vector count inflation. However, applying this approach to test compression has been considered challenging due to the limited availability of X-bits. This paper solves this serious problem by proposing a novel and practical CA (Compression-Aware) test modification scheme for reducing IR-drop in the widely-used broadcast-scan based test compression environment. This unique scheme features (1) CA circuit remodeling for minimizing the effort of applying test modification to broadcast-scan-based test compression, (2) CA X-identification for increasing X-bits for risky test vectors, and (3) CA X-filling for effectively using limited X-bits in reducing IR-drop. As a result, the CA test modification scheme can achieve significant IR-drop reduction even when a test cube only has a small number of X-bits. This advantage is clearly demonstrated by experimental results on three compression configurations created from an industrial circuit.

This paper presents a diagnostic test generation method for transition faults. As two consecutive vectors application mechanism, launch on capture test is considered. The proposed algorithm generates test vectors for given fault pairs using a stuck-at ATPG tool so that they are distinguished. If a given fault pair is indistinguishable, it is identified. Therefore the proposed algorithm provides a complete test generation regarding the distinguishability. The conditions for distinguishing a fault pair are carefully considered, and they are transformed into the conditions of the detection of a stuck-at fault, and some additional logic are inserted in a CUT for the test generation. Experimental results show that the proposed method can generate test vectors for distinguishing the fault pairs that are not distinguished by commercial tools, and also identify all the indistinguishable fault pairs.

We propose the fault model considering weak resistive opens inside the gate which might cause pattern-sequence-dependent and timing-dependent malfunction of the circuit. We assume the fixed observation interval for the signal transition, and derive the minimum resistance of intra-gate resistive opens to be detected as a fault by SPICE simulation. Based on the simulation results, we establish three fault models, that is, the one considering the location of the resistance, the one considering both the location and the resistance distribution, and the simplified one where str and stf faults considering the signal transition of the input ports are assumed. The coverage calculation for the primitive gates and small benchmark circuit reveals that the proposed models have more accuracy on the detection of weak open defects.

Capture-safety, defined as the avoidance of any timing error due to unduly high launch switching activity in capture mode during at-speed scan testing, is critical for avoiding test- induced yield loss. Although point techniques are available for reducing capture IR-drop, there is a lack of complete capture-safe test generation flows. The paper addresses this problem by proposing a novel and practical capture-safe test generation scheme, featuring (1) reliable capture-safety checking and (2) effective capture-safety improvement by combining X-bit identification & X-filling with low launch- switching-activity test generation. This scheme is compatible with existing ATPG flows, and achieves capture-safety with no changes in the circuit-under-test or the clocking scheme.

Test data modification based on test relaxation and X-filling is the preferable approach for reducing excessive IR-drop in at-speed scan testing to avoid test-induced yield loss. However, none of the existing test relaxation methods can control the distribution of identified don’t care bits (X-bits), thus adversely affecting the effectiveness of IR-drop reduction. In this paper, we propose a novel test relaxation method, called Distribution-Controlling X-Identification (DC-XID), which controls the distribution of X-bits identified from a set of fully-specified test vectors for the purpose of effectively reducing IR-drop. Experimental results on large industrial circuits demonstrate the effectiveness and practicality of the proposed method in reducing IR-drop, without any impact on fault coverage, test data volume, or test circuit size.

Under the modern manufacturing technologies, the open defect is one of the significant issues to maintain the reliability of DSM circuits. However, the modeling and techniques for test and diagnosis for open faults have not been established yet. In this paper, we give an important clue for modeling an open fault with considering the affects of adjacent lines. Firstly, we use computer simulations to analyze the defective behaviors of a line with the open defect. From the simulation results, we propose a new open fault model that is excited depending on the logic values at the adjacent lines assigned by a test. Next, we propose a diagnosis method that uses the pass/fail information to deduce the candidate open fault. Finally, experimental results show that the proposed method is able to diagnose the open faults with good resolution. It takes about 6 minutes to diagnose the open fault on the large circuit (2M gates).

Test catches defective parts. Traditional DFT makes test-related activities more cost effective. Debug and diagnosis discovers why a design or part did not work. Yield relates to how many good parts can be shipped thus how many dollars can be received. As one would expect, all these areas are related. The issue becomes: Can information from one operation be geared to better another? This panel specifically considers how test/DFT can aid in debug & diagnosis. The discussion is then extended to capture the impact on yield management in riskier contemporary and future processes. Over the past few decades, each of the above domains have gone through cycles of research, development, maturity and overhaul to adapt to changes in the process & product environment. In fact, because increasing degrees of uncertainty is introduced with modern nanometer processes, debug & diagnosis and yield management are becoming more recognized and valued portions of the product creation flow. To forward this, test and DFT functions are experiencing re-development. In building, executing and sustaining a competence, key issues include time & information. That is, the problem must be understood, solved in for the short term and solved for the long term. In addition, solution scope must be properly framed and, if possible, adaptable to unexpected changes in the process and tooling environments. It is well recognized that information availability and access are pillars of a debug/diagnosis solution. DFT structures, design automation tooling, test programs, ATE applications and physical failure analysis are means to a bulk of this data. The follow through is the assimilation of this data into a yield management and test quality system. As the topic is broad, panel of test experts will focus on practical experiences concerning the use of test, crafted DFT or test environments to facilitate debug and diagnosis. Precise developments in tying debug/diagnosis to yield management will also be discussed.

As a method to evaluate delay test quality of test patterns, SDQM (Statistical Delay Quality Model) has been proposed for transition faults. In order to derive better test quality by SDQM, the following two things are important: for each transition fault, (1) to find out the accurate length of the longest sensitizable paths along which the fault is activated and propagated, and (2) to generate a test pattern that detects the fault through as long paths as possible. In this paper, we propose a method to calculate the length of the potentially sensitizable longest path for detection of a transition fault. In addition, we develop a procedure to extract path information that helps high quality transition ATPG. Experimental results show that the proposed method not only derives more accurate SDQL (Statistical Delay Quality Level) but also enhances the test quality of generated test patterns.

In order to generate correct at-speed scan patterns, the effect of timing exceptions and constraints needs to be considered during test generation. A path-oriented approach to handle timing exception paths during at-speed ATPG has been presented in (Vorisek et al., 2006). The new method has been applied to and tested on many example circuits at Semiconductor Technology Academic Research (STARC). This paper presents a sample of these test cases, and illustrates how the proposed method generates correct-by-construction at-speed patterns on these circuits without pessimism

In this paper, a new ATPG methodology is proposed to improve the quality of test sets generated for detecting delay defects. This is achieved by integrating timing information, e.g. from standard delay format (SDF) files, into the ATPG tool. The timing information is used to guide the test generator to detect faults through the longest paths in order to improve the ability to detect small delay detects. To avoid propagating faults through similar paths repeatedly, a weighted random method is proposed to improve the path coverage during test generation. During fault simulation, a new fault-dropping criterion, named dropping based on slack margin (DSM), is proposed to facilitate the trade-off between the test set quality and the test pattern count. The quality of the generated test set is measured by two metrics: delay test coverage and SDQL. The experimental results show that significant test quality improvement is achieved when applying timing-aware ATPG with DSM to industrial designs

The authors have developed a scheme for scan-based BIST that can compress test stimuli and responses by more than 100 times. The scheme is based on a scan-BIST architecture, and combines four techniques: the invert-and-shift operation, run-length compression, scan address partitioning, and LFSR pre-shifting. The scheme achieved a 100times compression rate in environments where Xs do not occur without reducing the fault coverage of the original ATPG vectors. Furthermore, the masking logic was enhanced to reduce data for X-masking so that test data is still compressed to 1/100 in a practical environment where Xs occur. The scheme was applied to five real VLSI chips, and the technique compressed the test data by 100times for scan-based BIST

No abstract available.

We propose a Design for Testability System for Mega Gate LSIs. This system meets various demands of designers, because this system has high flexibility. We show the flexibility by introducing some examples of circuit insertion which is supported by the system.

In this paper, we present a test synthesis approach which integratesBALLAST (BALAnced structure Scan Test) withan enhanced test point insertion (TPI) algorithm to functionallyscan the flip-flops chosen by BALLAST.BALLASTis an attractive partial scan technique in that it offers combinationalATPG efficiency while promising to reduce full scanoverhead.However, the practical problem with BALLASTis it typically requires more scan flip-flops than other partialscan techniques.The TPI enhancements enable TPI toaim at the reduction of BALLAST overhead.The enhancementsinclude a more flexible test point insertion heuristic,a modified gain function which enables TPI to target a selectedset of flip-flops, and a more efficient procedure toremove redundant test points.The experimental results onnine benchmark circuits show the proposed test synthesisapproach can achieve on average 38% area saving comparedto full scan, while BALLAST alone achieves 17%.

The authors propose a novel test CAD (computer-aided-design) system for ASIC (application-specific integrated circuits), including megacells which automatically insert high-testability logic. The strategy is to access megacells directly and independently. The overhead is only 2% to 3% of the total number of gates. With the proposed system, hierarchically designed logic data can be converted to high-testability logic. It is not necessary for the designers to have specialized knowledge about design-for-testability.>