Demo Data from EDBT 2026 / reviewers in the wild / expert
Savvas G. Chamberlain
dblp:46/285
· DBLP profile ↗
6ranked-venue papers
0as first author
0since 2021 · last 1995
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 6
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
4 papers |
Electronic design automation · 50% Integrated circuit design · 43% Memory systems · 6% |
Topics — the 10 heaviest of 11, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › semiconductor device modeling
thin-film transistor modeling |
0.0 | 1 | 1992 | A numerical model for two-dimensional transient simulation of amorphous silicon thin-film transistors · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Electronic design automation › circuit simulation
transient analysis |
0.0 | 1 | 1992 | A numerical model for two-dimensional transient simulation of amorphous silicon thin-film transistors · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Electronic design automation
circuit simulation |
0.0 | 2 | 1991 | CHORD: a modular semiconductor device simulation development tool incorporating external network models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989 Buried-channel MOSFET model for SPICE · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991 |
Integrated circuit design
analog and mixed-signal circuits |
0.0 | 1 | 1991 | Buried-channel MOSFET model for SPICE · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991 |
Integrated circuit design › analog and mixed-signal circuits › device modeling
MOSFET modeling |
0.0 | 1 | 1991 | Buried-channel MOSFET model for SPICE · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991 |
Electronic design automation › technology computer-aided design
semiconductor device simulation |
0.0 | 1 | 1989 | CHORD: a modular semiconductor device simulation development tool incorporating external network models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989 |
Electronic design automation › technology computer-aided design
device simulation |
0.0 | 1 | 1992 | A numerical model for two-dimensional transient simulation of amorphous silicon thin-film transistors · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Electronic design automation › circuit modeling
SPICE modeling |
0.0 | 1 | 1991 | Buried-channel MOSFET model for SPICE · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1991 |
Memory systems › semiconductor memory
charge-coupled device memory |
0.0 | 1 | 1980 | Design and Realization of a Two-Level 64K Byte CCD Memory System for Microcomputer Applications · IEEE Trans. Computers 1980 |
Memory systems › memory hierarchy
two-level memory system |
0.0 | 1 | 1980 | Design and Realization of a Two-Level 64K Byte CCD Memory System for Microcomputer Applications · IEEE Trans. Computers 1980 |
Methods — techniques the papers use, named apart from their topics
two-dimensional transient numerical simulation · 0.0linearized shockley-read-hall trapping · 0.0transient analysis · 0.0small-signal analysis · 0.0modified nodal analysis · 0.0byte-stream communication · 0.0hardware design · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1995 | An Architecture for Integrated Reliability Simulators Using Analog Hardware Description LanguagesabstractA new architecture for integrated reliability simulators is presented. The architecture is compatible with analog hardware description language simulation environments. Simulator integration is achieved by incorporating the reliability evaluation routines into the component templates through the use of analog states. An internal simulation control mechanism is substituted for the external control shell found in conventional reliability simulators. The architecture supports iterative and multi-step reliability simulation schemes. A prototype reliability simulator for amorphous silicon circuits is also presented. S. M. GadelRab, James A. Barby, Savvas G. Chamberlain |
ISCAS | 3 |
| 1992 | A numerical model for two-dimensional transient simulation of amorphous silicon thin-film transistorsabstractA model based on a linearized solution of the Shockley-Read-Hall trapping expressions is presented. It allows these equations to be eliminated from the system matrix. This results in significantly reduced memory requirements and execution times. To illustrate the approach, the switch-on and switch-off transients of a thin-film transistor were simulated. These results are compared with ones obtained from the full two-dimensional transient numerical model. It is shown that the linearized model can simulate a wide variety of device behavior, providing close agreement with the full model at a fraction of the cost.> John R. F. McMacken, Savvas G. Chamberlain |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 1991 | Buried-channel MOSFET model for SPICEabstractA buried-channel (BC) MOSFET model for DC, transient and small-signal circuit simulation, which has been incorporated into SPICE 3B1, is presented. The model includes all of the modes of operation inherent to the BC-MOSFET, including the partial modes of operation. The equivalent circuit for the BC-MOSFET is presented, and the static, transient, and small-signal equations used for SPICE implementation are systematically described. The surface and bulk mobility models used in the static current-voltage characteristic are highlighted. The charge model and the importance of incorporating all of the models of operation are illustrated. A number of examples are given to illustrate the BC-MOSFET SPICE model. It is shown that the SPICE model for the BC-MOSFET is in good agreement with experimental measurements.> Michael J. Van der Tol, Savvas G. Chamberlain |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 1989 | CHORD: a modular semiconductor device simulation development tool incorporating external network modelsabstractA description is given of CHORD, a semiconductor device simulation development tool created at the University of Waterloo. CHORD is written as several small independent programs which use a centralized database facility and is specifically designed to allow the simple creation, development, and testing of new simulation models and algorithms. Communication between programs is implemented by using a byte-stream process. This allows transfer of information between individual programs running on different machines. CHORD is a general environment in that its models can incorporate any set of user-defined variables of equations. This is illustrated by the development of contact boundary conditions incorporating external circuit elements and circuit-level device models using the modified nodal formulation. Several examples of both steady-state and transient simulations are presented.> John R. F. McMacken, Savvas G. Chamberlain |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 1984 | Foreword
Constantine N. Anagnostopoulos, Savvas G. Chamberlain |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 1980 | Design and Realization of a Two-Level 64K Byte CCD Memory System for Microcomputer ApplicationsabstractCharge coupled device (CCD) memory technology offers potential economic advantages over semiconductor random-access memory technology. However, the limitations incurred by the serial nature of CCD's have previously restricted their application to computer mainframe memories. The 64 kbyte CCD memory system described in this paper demonstrates the feasibility of CCD memory technology for moderate size memory systems applicable to microcomputer systems. Design objectives included low cost, adequate performance, reliable operation, small size, and low power consumption as well as simple interfacing to standard microprocessors. A simple two-level organization employing a random access memory (RAM) to buffer the serial CCD memory was used to improve the memory system performance and to simplify the interfacing of microcomputers. It is anticipated that the memory system can be easily modified to use 64 kbit and larger CCD memory devices as these become available. Further more, the memory system control logic could be integrated on a single large-scale integration (LSI) chip, thereby facilitating the fabrication of relatively large and economical memory systems with a low component count. Robert J. Inkol, Savvas G. Chamberlain |
IEEE Trans. Computers | 2 |