In order to perform accurate parasitic extraction, foundries must provide the cross section profile of devices, and IP vendors must provide sufficient layout information. However, foundries and IP vendors are increasingly reluctant to reveal such sensitive information, especially for advanced devices. Therefore, the industry is faced with the following challenges: 1) foundries/IP vendors need to protect their trade secrets; 2) electronic design automation vendors need to integrate foundry data into extraction tools; and 3) IC designers need to have the accurate parasitic data. In this paper, we propose an innovative and practical solution to these challenges, by building a macro model around any region in 2-D/3-D on a circuit where foundries or IP vendors wish to hide information, yet the macro model allows accurate capacitance extraction inside and outside of the region. We first give algorithms to construct the macro model. Then, we describe how existing extraction algorithms can interface with the macro model to perform extraction for the entire circuit at the same accuracy as if complete information was given. The macro model can be used in finite difference method/finite element method and floating random walk, due to an equivalence theorem we proved. Finally, we propose the concept of equivalent profile and describe how to find one based on the macro model. Experimental results show the macro model can be efficiently constructed and used to produce accurate capacitance extraction.

Testing longer paths in an integrated circuit with a proper path selection strategy has the potential to increase the quality of a delay test. However, the benefit on silicon is not completely clear because a theoretical test quality increase is normally simulated using an assumed distribution of defect sizes. In this work, silicon data is collected and maximum operating frequency (Fmax) compared using test patterns generated by a variety of delay test methodologies. The silicon data is consistent with theoretical predictions and the benefits of testing delay faults through the longest path are quantified.

Excessive power supply noise can lead to overkill during delay test. A static test vector compaction solution is described to prevent such overkill. Low-cost power supply noise models are developed and used in compaction. An error analysis of these models is given. This paper improves on prior work in terms of models and algorithm to increase accuracy and performance. Experimental results are given on ISCAS89 circuits

Excessive power supply noise can lead to overkill during delay test. A static compaction algorithm is described in this paper that prevents such overkill. A power supply noise estimation tool has been built and integrated into the compaction process. Compaction results for KLPG delay tests for ISCAS89 circuits under different power grid environments are presented.

Under manufacturing process variation, a path through a net is called longest if there exists a process condition under which the path has the maximum delay among all paths through the net. There are often multiple longest paths for each net, due to different process conditions. In addition, a local defect, such as resistive open or a resistive bridge, increases the delay of the affected net. To detect delay faults due to local defects and process variation, it is necessary to test all longest paths through each net. Previous approaches to this problem were inefficient because of the large number of paths that are not longest. This paper presents an efficient method to generate the set of longest paths for delay test under process variation. To capture both structural and process correlation between path delays, we use linear delay functions to express path delays under process variation. A novel technique is proposed to prune paths that are not longest, resulting in a significant reduction in the number of paths. In experiments on International Symposium on Circuits and Systems (ISCAS) circuits, our number of longest paths is 1-6% of the previous best approach, with 300/spl times/ less running time.

To detect the smallest delay faults at a fault site, the longest path(s) through it must be tested at full speed. Existing test generation tools are inefficient in automatically identifying the longest testable paths due to the high computational complexity. In this work a test generation methodology for scan-based synchronous sequential circuits is presented, under two at-speed test strategies used in industry. The two strategies are compared and the test generation efficiency is evaluated on ISCAS89 benchmark circuits and industrial designs. Experiments show that testing transition faults through the longest paths can be done in reasonable test set size.

The path delay fault model is the most realistic model for delay faults. Testing all the paths in a circuit achieves 100% delay fault coverage according to traditional path delay fault coverage metrics. These metrics result in unrealistically low fault coverage if only a subset of paths is tested, and the real test quality is not reflected. For example, the traditional path delay fault coverage of any practical test for circuit c6288 is close to 0 because this circuit has an exponential number of paths. In this paper, a statistical and realistic path delay fault coverage metric is presented. Then the quality of several existing test sets (path selection methods) is evaluated in terms of local and global delay faults using this metric, in comparison with the transition fault and traditional path delay fault coverage metrics.

Testing the K longest paths through each gate (KLPG) in a circuit detects the smallest local delay faults under process variation. In this work a novel automatic test pattern generation (ATPG) methodology to find the K longest testable paths through each gate in a combinational circuit is presented. Many techniques are used to significantly reduce the search space. The results on the ISCAS benchmark circuits show that this methodology is very efficient and able to handle circuits with an exponential number of paths, such as c6288. 1.

Delay faults are an increasingly important test challenge. Traditional open and bridge fault models are incomplete because only the functional fault or a subset of delay fault are modeled. In this paper, we propose a circuit level model for resistive open and bridge faults. All possible fault behaviors are illustrated and a general resistive bridge delay calculation method is proposed. The new models are practical and easy to use. Fault simulation results show that the new models help the delay test to catch more bridge faults.

Delay faults are an increasingly important test challenge. Modeling bridge faults as delay faults helps delay tests to detect more bridge faults. Traditional bridge fault models are incomplete because these models only model the logic faults or these models are not efficient to use in delay tests for large circuits. In this article, we propose a physically realistic yet economical resistive bridge fault model to model delay faults as well as logic faults. An accurate yet simple delay calculation method is proposed. We also enumerate all possible fault behaviors and present the relationship between input patterns and output behaviors, which is useful in ATPG. Our fault simulation results show the benefit of at-speed tests.