EDBT 2026 Demo / reviewers in the wild / expert
Yue Zhao 0029
dblp:48/76-29
· DBLP profile ↗
4ranked-venue papers
1as first author
4since 2021 · last 2025
0000-0002-3341-6294ORCID · verified
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 4 · 1 first-author · 4 since 2021
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2025 | A 28-nm 9T1C SRAM-Based CIM Macro With Hierarchical Capacitance Weighting and Two-Step Capacitive Comparison ADCs for CNNsabstractIn the realm of charge-domain computing-in-memory (CIM) macros, reducing the area of capacitor ladder and analog-to-digital converter (ADC) while maintaining high throughput remains a significant challenge. This brief introduces an adjustable-weight CIM macro designed to enhance both energy efficiency and area efficiency for convolutional neural networks (CNNs). The proposed architecture uses: 1) a customized 9T1C bit cell for sensing margin improvement and bidirectional decoupled read ports; 2) a hierarchical capacitance weighting (HCW) structure that achieves a weight accumulation of 1/2/4 bits with less capacitance area and weighting time; and 3) a two-step capacitive comparison ADCs (TC-ADCs) readout scheme to improve area efficiency and throughput. The proposed 8-kb static random address memory (SRAM) CIM macro is implemented using 28-nm CMOS technology. It can achieve an energy efficiency of 224.4 TOPS/W and an area efficiency of 21.894 TOPS/mm2, and the accuracies on MNIST, CIFAR-10, and CIFAR-100 datasets are 99.67%, 89.13%, and 67.58% with a 4-b input and 4-b weight. Zhi-Ting Lin, Runru Yu, Miao Long, Yu Liu 0113, Jianxing Zhou, Qingchuan Zhu, Yue Zhao 0029, Lintao Chen, Chunyu Peng, Qiang Zhao 0007, Xin Li 0099, Chenghu Dai, Xiulong Wu |
IEEE Trans. Very Large Scale Integr. Syst. | 9 |
| 2024 | SRAM-Based Digital CIM Macro for Linear Interpolation and MACabstractLinear interpolation is widely used in algorithms such as image segmentation, but the existing compute-in-memory (CIM) architectures cannot satisfy the needs of linear interpolation. This paper proposes a CIM macro based on static random-access memory (SRAM) that implements linear interpolation for the first time. Swing multiplication and accumulation are proposed in this paper for linear interpolation operations. In addition, the proposed circuit can be used for multiply-and-accumulate (MAC) operation and supports parallel updating and computing. A new adder tree by reused the adders inside the multiplier to implement the accumulation operation. The proposed circuit can improve the area efficiency as no additional adder tree circuit is required. The design is implemented in a 28 nm process and area efficiency can achieve 0.059 TOPS/mm2for MAC operation. When operating with an 8-bit linear interpolation, this CIM macro achieves access times of 6−9 ns and energy efficiencies of 11.13−17.72 TOPS/W. Under MAC operation with 8-bit inputs and weights, this CIM macro achieves access time of 6.36−9.47 ns and energy efficiency of 4.61−8.36 TOPS/W for 19-bit outputs. Zhi-Ting Lin, Yunlong Liu 0006, Yaling Wang, Yue Zhao 0029, Chunyu Peng, Xiulong Wu |
ISCAS | 4 |
| 2023 | In-Memory Transposable Multibit Multiplication Based on Diagonal Symmetry Weight BlockabstractA possible approach to overcome the von Neumann bottleneck and meet the increasing demand for better computing performance is to computing in-memory (CIM). The results of the in-memory calculations are primarily reflected in the vertical bitline (BL) analog voltage. However, the nonlinearity of the BL discharge deteriorates with the increase in discharge voltage. In this study, we propose a diagonal symmetry weight block (DSWB) based on an eight-transistor (8T) static random access memory (SRAM) that can achieve multibit transposable operations. In addition, to guarantee linearity and complete multibit multiplication operations, we propose a cascode current mirror (CCM)-based multiplier. To achieve low-overhead and more efficient quantification, our proposed CIM macro uses a counter-type quantization circuit to read out the analog calculation results. We simulated the performance of the proposed 8T SRAM in a 28-nm complementary metal–oxide–semiconductor process. The integral nonlinearity (INL) of the proposed CCM-based CIM decreased by approximately 54.4% compared with the traditional CIM. Furthermore, the proposed in-memory multibit multiplication throughput density was 6.74 GOPS/kb; this throughput density improvement is approximately 3.3–10.5 times higher than the existing CIM works. Zhongzhen Tong, Yue Zhao 0029, Jin Zhang 0036, Zhi-Ting Lin, Xiaoyang Lin, Xiulong Wu |
IEEE Trans. Very Large Scale Integr. Syst. | 2 |
| 2022 | Configurable Memory With a Multilevel Shared Structure Enabling In-Memory ComputingabstractFrequent to-and-from data transfers in the von Neumann architecture limit the overall throughput. One of the promising approaches used to overcome von Neumann bottleneck is in-memory computing (IMC) that aims to embed computing in memory to reduce the transfer of memory-processor data. This study proposes a configurable 6-transistor (6T) static random access memory (SRAM) array with a multilevel shared structure for IMC. A multilevel shared structure can effectively improve the utilization rate of the module. In addition to the conventional SRAM operation, the configurable structure can also perform the sum of absolute differences (SAD) and Hamming distance (HD) calculations. To quickly identify the minimum value among multiple calculation results, a four-input sense amplifier (SA) is proposed. The performance of the proposed memory is simulated in a 65-nm CMOS process. The post-layout simulation results show good linearity of the multirow read in the SAD and HD modes. The mean time required by the four-input SA to obtain the result is 190 ps. The SAD and HD calculations yield consumptions of 67.44 fJ/byte and 0.64 fJ/bit, respectively, at 0.8 V. Furthermore, a single column-sharing comparator consumes 2.78 and 3.41 pJ at 0.8 V in the SAD and HD modes, respectively. Yue Zhao 0029, Zhi-Ting Lin, Xiulong Wu, Qiang Zhao 0007, Wenjuan Lu, Chunyu Peng, Zhongzhen Tong, Junning Chen |
IEEE Trans. Very Large Scale Integr. Syst. | 1 |