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Herbert Reichl

dblp:53/6296 · DBLP profile ↗
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2ranked-venue papers
0as first author
0since 2021 · last 2009
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Computer networks · 2

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
2 papers
Internet of things and sensor networks · 100%
Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 60% Integrated circuit design · 40%

Topics — the 2 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Internet of things and sensor networks › wireless sensor network
wireless sensor nodes		 0.222009
SENESCOPE: A design tool for cost optimization of wireless sensor nodes · IPSN 2009
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies · IPSN 2006
Integrated circuit design › packaging
three-dimensional packaging		 0.012006
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies · IPSN 2006

Methods — techniques the papers use, named apart from their topics

event-driven simulation · 0.1
YearPublicationVenuePosition
2009 SENESCOPE: A design tool for cost optimization of wireless sensor nodes
M. Niedermayer, C. Richter, J. Hefer, Stephan Guttowski, Herbert Reichl
 IPSN5
2006 Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
abstract
Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. An event driven simulator in combination with a 3D placement tool was used to predict the total system volume. The potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implementations.
M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl
 IPSN6