This paper explains the design, implementation, and application of communication between Microcontroller and FPGA using MQTT protocol. While there has been similar communication between the Microcontroller and FPGA using Bluetooth and RF modules, Wi-Fi modules can establish a larger network for communication, have larger coverage, and higher speed. Embedded systems using both the FPGA and microcontrollers bind the devices to performing specific functionalities, such cross-platform communication is not common. The use of microcontrollers in embedded systems is common because they are user friendly and comparatively easy to program. FPGA however involve parallel programming, increasing design complexity while increasing processing speed. FPGA can be used as central processing unit that improves system performance and frees up microcontrollers from cycle intensive tasks. In this project, the MSP432 microcontroller and BASYS3 FPGA board are made to communicate by using a MQTT protocol. A mobile application which acts as a MQTT. broker (server) is initialized at certain static IP address. The Wi-Fi module connected to the MSP432 generates an Access Point to which the Wi-Fi module at BASYS3 and the mobile phones connect to. This establishes a wireless network between the three devices. Messages are then exchanged using UART communication which sends or receives characters on pressing the onboard pushbuttons. Bidirectional messages are sent or received based on the publisher/subscriber mode of BASYS3 and MSP432 board.

In this paper, we present a new readout circuit with an integrated built-in self-test (BIST) structure for capacitive microelectromechanical system (MEMS). In the proposed solution, instead of commonly used voltage control signals to test the device, charge-controlled stimuli are employed to cover a wider range of structural defects. The proposed test solution eliminates the risk of structural collapse in the test phase for gap-varying parallel-plate MEMS devices. Measurement results using a prototype fabricated in TSMC 65-nm CMOS technology indicate that the proposed BIST scheme can successfully detect minor structural defects altering MEMS nominal capacitance.

Testing the integrity of interconnects realized by through silicon vias (TSVs) in 3-D integrated circuits (3-D IC) is considered a challenging task. TSVs are excessively small and fragile for current probe technology. In this paper, a new spring-type probe using microelectromechanical systems (MEMS) technology is presented. The implemented MEMS probe supports the required pitch for TSV direct probing and minimizes the undesired scrub marks on TSV surface. Simulation results indicate that the implemented MEMS probe can operate at the gigahertz frequency range without significant test signal degradation.

A new Built-in Self-Test (BIST) method for capacitive Micro-Electrical-Mechanical System (MEMS) devices using charge-control method has been developed in which the Device Under Test (DUT) is stimulated through current sources. The DUT output signals are first converted to time domain intervals and then measured through a precision Time-to-Digital converter (TDC). The proposed BIST scheme supports self-calibration and produces robust results under process, supply and temperature variations. Simulation results indicate that this method can successfully detect minor structural defects altering the MEMS nominal capacitance by 70af.

At gigahertz frequency range, performance degradation of the device interface board increases the yield loss and the cost of manufacturing. In this poster a MEMS based solution is proposed to design a Device Interface Board (DIB) supporting high-speed connectivity between the device under test and the tester. Simulation results indicate that the proposed scheme can operate up to 50 GHz without considerable signal integrity degradation.