Two diverse manufacturing techniques for building 3-D integrated systems are vertical integration with Through-Silicon-Vias (TSVs), also referred as 3-D TSV integration, and 3D monolithic integration. In this paper, we present a hybrid integration scheme that combines these two approaches, taking into account their existing technology limits, into a disruptive paradigm called 3.5-D integration. Our novel integration supports circuit-partitioning both at the gate and block level with unprecedented benefits in cost. To demonstrate the effectiveness of 3.5-D integration, we chose as case study a 288-core MPSoC and we made hypothesis on the manufacturing and test cost. We argue a potential 20% decrease in the manufacturing cost and 30% decrease in the test cost when compared to 3-D TSV integration. In order to study the performance improvement of the MPSoC, we benchmarked various blocks of the core and the on-chip interconnection network, connecting all the cores. Our study shows large improvement in performance of the core (average of 11.5%) and latency (average of 24%) of the Network-on-Chip (NoC) for the 3.5-D integration when compared to the corresponding 3-D TSV implementation.

Many classes of applications require Quality of Service (QoS) guarantees from the system interconnect. In Networks-on-Chip (NoC) QoS guarantees usually translate into bandwidth and latency constraints for the traffic flows and require hardware support in the NoC fabric and its interfaces. In this article we present a novel NoC synthesis framework to automatically build networks that meet hard latency constraints of end-to-end traffic streams without requiring specialized hardware for the network components. The hard latency constraints are met by carefully designing the NoC topology and selecting the appropriate routes for flow using lean best-effort network components. We perform experiments on several System on Chip (SoC) benchmarks. We compared against a topology synthesis method with no support for real-time constraints and we show that the proposed method can produce topologies that can meet significantly tighter worst case latency constraints (on average 44%). We also show that the tightest worst case latency can be provided with little overhead on power consumption (on average 8.5%).

Many core chips are emerging as the architecture of choice to provide power efficiency and improve performance, while riding Moore's Law. In these architectures, on-chip inter-connects play a pivotal role in ensuring power and performance scalability. As supply voltages begin to level off in future technologies, chip designs in general and interconnects in particular will require specialization to meet power and performance objectives. In this work, we make the observation that cache-coherent many core server chips exhibit a duality in on-chip network traffic. Request traffic largely consists of simple control messages, while response traffic often carries cache-block-sized payloads. We present Cache-Coherence Network-on-Chip (CCNoC), a design that specializes the NoC to fit the demands of server workloads via a pair of asymmetric networks tuned to the type of traffic traversing them. The networks differ in their data path width, router micro architecture, flow control strategy, and delay. The resulting heterogeneous CCNoC architecture enables significant gains in power efficiency over conventional NoC designs at similar performance levels. Our evaluation reveals that a 4×4 mesh-based chip multiprocessor with the proposed CCNoC organization running commercial server workloads is 15-28% more energy efficient than various state-of-the-art single- and dual-network organizations.

Research on Networks on Chips (NoCs) has spanned over a decade and its results are now visible in some products. Thus the seminal idea of using networking technology to address the chip-level interconnect problem has been shown to be correct. Moreover, as technology scales down in geometry and chips scale up in complexity, NoCs become the essential element to achieve the desired levels of performance and quality of service while curbing power consumption levels. Design and timing closure can only be achieved by a sophisticated set of tools that address NoC synthesis, optimization and validation.

Networks-on-Chip (NoCs) are a promising interconnect paradigm to address the communication bottleneck of Systems-on-Chip (SoCs). Wormhole flow control is widely used as the transmission protocol in NoCs, as it offers high throughput and low latency. To match the application characteristics, customized irregular topologies and routing functions are used. With wormhole flow control and custom irregular NoC topologies, deadlocks can occur during system operation. Ensuring a deadlock free operation of custom NoCs is a major challenge. In this paper, we address this important issue and present a method to remove deadlocks in application-specific NoCs. Our method can be applied to any NoC topology and routing function, and the potential deadlocks are removed by adding minimal number of virtual or physical channels. Experiments on a variety of realistic benchmarks show that our method results in a large reduction in the number of resources needed (88% on average) and NoC power consumption, area reduction (66% area savings on average) when compared to the state-of-the-art deadlock removal methods.

Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient network on chip (NoC) interconnect for a 3-D SoC that meets not only the application performance constraints but also the constraints imposed by the 3-D technology is a significant challenge. In this paper, we present a design tool, SunFloor 3D, to synthesize application-specific 3-D NoCs. The proposed tool determines the best NoC topology for the application, finds paths for the communication flows, assigns the network components to the 3-D layers, and places them in each layer. We perform experiments on several SoC benchmarks and present a comparative study between 3-D and 2-D NoC designs. Our studies show large improvements in interconnect power consumption (average of 38%) and delay (average of 13%) for the 3-D NoC when compared to the corresponding 2-D implementation. Our studies also show that the synthesized topologies result in large power (average of 54%) and delay savings (average of 21%) when compared to standard topologies.

Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (NoCs) are necessary to efficiently handle the 3D interconnect complexity. Designing power efficient NoCs for 3D SoCs that satisfy the application performance requirements, while satisfying the 3D technology constraints is a big challenge. In this work, we address this problem and present a synthesis approach for designing power-performance efficient 3D NoCs. We present methods to determine the best topology, compute paths and perform placement of the NoC components in each 3D layer. We perform experiments on varied, realistic SoC benchmarks to validate the methods and also perform a comparative study of the resulting 3D NoC designs with 3D optimized mesh topologies. The NoCs designed by our synthesis method results in large interconnect power reduction (average of 38%) and latency reduction (average of 25%) when compared to traditional NoC designs.

In many Systems on Chips (SoCs), the cores are clustered in to voltage islands. When cores in an island are unused, the entire island can be shutdown to reduce the leakage power consumption. However, today, the interconnect architecture is a bottleneck in allowing the shutdown of the islands. In this paper, we present a synthesis approach to obtain customized application-specific Networks on Chips (NoCs) that can support the shutdown of voltage islands. Our results on realistic SoC benchmarks show that the resulting NoC designs only have a negligible overhead in SoC active power consumption (average of 3%) and area (average of 0.5%) to support the shutdown of islands. The shutdown support provided can lead to a significant leakage and hence total power savings.

Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on Chip (NoC) interconnect for a 3D SoC that not only meets the application performance constraints, but also the constraints imposed by the 3D technology, is a significant challenge. In this work we present a design tool, SunFloor 3D, to synthesize application-specific 3D NoCs. The proposed tool determines the best NoC topology for the application, finds paths for the communication flows, assigns the network components on to the 3D layers and performs a placement of them in each layer. We perform experiments on several SoC benchmarks and present a comparative study between 3D and 2D NoC designs. Our studies show large improvements in interconnect power consumption (average of 38%) and delay (average of 13%) for the 3D NoC when compared to the corresponding 2D implementation. Our studies also show that the synthesized topologies result in large power (average of 54%) and delay savings (average of 21%) when compared to standard topologies.