In this presentation, an overview of low-temperature processing for thin-film transistor array fabrication, using jet-printing, will be given along with the integration of these backplanes with organic and inorganic sensor materials. The approach using jetprinting, or digital lithography, provides an extra degree of freedom for patterning device structures on flexible platforms. This technique allows for real-time monitoring of layer registration and alignment correction using a digital patterning technique. The characterization of low-temperature compatible materials will also be reviewed in regard to conditions that determine device stability and performance in silicon-based devices. A rapid testing strategy that identifies many common defects in flexible backplane arrays will be presented. Finally, an overview of specific applications for flexible backplanes, displays, and image sensor arrays will be given.

Two digital printing methods for the fabrication of active matrix thin-film transistor (AM-TFT) backplanes for displays are described. A process using printed resists layers, referred to as digital lithography, was used to fabricate arrays of hydrogenated amorphous silicon TFTs. TFTs were also fabricated using a combination of digital lithography to pattern metals and inkjet printing to pattern and deposit a polymeric semiconducting layer. The relative performance of amorphous silicon and polymer TFTs were evaluated. The utility of digital lithographic processing was demonstrated by the fabrication of prototype reflective displays using electrophoretic media.