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Sanggeun Jeon

dblp:57/9102 · DBLP profile ↗
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3ranked-venue papers
1as first author
1since 2021 · last 2021
0000-0001-7453-2331ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 1 first-authorComputer networks · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
1 paper
Physical-layer communications · 70% Cellular and mobile networks · 23% Wireless networking · 7%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Physical-layer communications
modulation
0.512021
Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications · IEEE J. Sel. Areas Commun. 2021
Physical-layer communications › modulation › amplitude modulation
on-off keying
0.512021
Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications · IEEE J. Sel. Areas Commun. 2021
Cellular and mobile networks › 6g
terahertz communication
0.512021
Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications · IEEE J. Sel. Areas Commun. 2021
Physical-layer communications › signal processing for communications
transceiver design
0.512021
Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications · IEEE J. Sel. Areas Commun. 2021
Wireless networking
wireless personal area network
0.112021
Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications · IEEE J. Sel. Areas Commun. 2021

Methods — techniques the papers use, named apart from their topics

monte carlo simulation · 0.5link budget analysis · 0.5
YearPublicationVenuePosition
2021 Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications
abstract
Terahertz (THz) communication is a promising technique for chip-to-chip communication and wireless personal area networks. In this paper, we present an experimental study and design to realize such THz communication systems. We develop two different chip sets for on-off-keying (OOK) modulation based THz transceivers which include carrier generators, modulators, THz amplifiers, and baseband amplifiers. Specifically, the first chip set integrates the circuit blocks for the OOK modulation without the THz amplifier for short-range communication. In addition, the second chip set design includes the THz amplifier modules to extend the coverage of transmission. For these two chip sets, we experimentally demonstrate the feasibility of the wireless communication at THz frequency bands and assess performance using the bit error rate (BER) analysis. We estimate the BER by calculating the signal-to-noise ratio (SNR) based on the eye diagram and compare with actual BER measurements and Monte Carlo simulations. We also address the impact of the distance, the transmit power, and the data rate for the proposed THz transceivers based on the link budget analysis, and confirm the accuracy of the derived BER expression.
Changhwan Yi, Dongkyo Kim, Sourabh Solanki, Jae-Hong Kwon, Moonil Kim, Sanggeun Jeon, Young-Chai Ko, Inkyu Lee
IEEE J. Sel. Areas Commun.6
2019 WR-3 Band Integrated Circuits in InP HBT Technology
abstract
This paper presents a review of WR-3 band monolithic integrated circuits developed in an InP HBT technology. Envisioning potential applications of terahertz such as short-distance communication, imaging or spectroscopy, various circuit blocks are presented, including power amplifiers, oscillators, mixers, phase shifter, and switch. The design guideline and measurement result of each circuit are provided. Finally, WR-3 band heterodyne transmitter and receiver chips are introduced.
Sanggeun Jeon, Jae-Sung Rieh, Moonil Kim
ISCAS1
2012 Recent progress in terahertz monolithic integrated circuits
abstract
An overview of recent progress in terahertz monolithic integrated circuits (TMICs) is presented in this paper. Semiconductor technologies available for TMIC implementation are described, and recent results on amplifiers and signal sources operating at THz band are discussed. Finally, the current status of THz integrated transceiver system is reviewed.
Moonil Kim, Jae-Sung Rieh, Sanggeun Jeon
ISCAS3