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Xia An

dblp:63/7419 · DBLP profile ↗
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11ranked-venue papers
1as first author
4since 2021 · last 2026
0009-0008-4395-1742ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 8 · 2 since 2021Systems, architecture and hardware · 2 · 1 since 2021Computer networks · 1 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
8 papers
Integrated circuit design · 56% Hardware reliability and fault tolerance · 36% Memory systems · 8%

Topics — the 13 heaviest of 14, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
semiconductor device fabrication
0.932018
Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology · Sci. China Inf. Sci. 2018
GeC film with high substitutional carbon concentration formed by ion implantation and solid phase epitaxy for strained Ge n-MOSFETs · Sci. China Inf. Sci. 2018
Ge surface passivation by GeO2 fabricated by N2O plasma oxidation · Sci. China Inf. Sci. 2015
Hardware reliability and fault tolerance › soft errors
single event transient
0.612022
Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence · Sci. China Inf. Sci. 2022
Hardware reliability and fault tolerance
soft errors
0.612022
Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence · Sci. China Inf. Sci. 2022
Hardware reliability and fault tolerance › radiation effects
total ionizing dose effects
0.512021
Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET · Sci. China Inf. Sci. 2021
Integrated circuit design
digital circuit design
0.412020
Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020
Integrated circuit design › semiconductor device modeling
transistor modeling
0.412020
Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020
Memory systems › non-volatile memory
resistive memory
0.412019
Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields · Sci. China Inf. Sci. 2019
Integrated circuit design › semiconductor devices › field-effect transistor
MOSFET
0.112021
Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET · Sci. China Inf. Sci. 2021
Integrated circuit design › analog and mixed-signal circuits
device modeling
0.112020
Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020
Integrated circuit design
low-power circuit design
0.112019
Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields · Sci. China Inf. Sci. 2019
Integrated circuit design › semiconductor device fabrication
CMOS technology
0.112009
Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009
Integrated circuit design
technology scaling
0.112009
Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009
Integrated circuit design › semiconductor devices › device scaling
CMOS scaling limits
0.012009
Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009

Methods — techniques the papers use, named apart from their topics

pulse laser testing · 0.6solid phase epitaxy · 0.3nitrogen plasma pretreatment · 0.3ion implantation · 0.3plasma oxidation · 0.2survey · 0.1
YearPublicationVenuePosition
2026 Deep Reinforcement Learning Aided Scheduling Design for Pipelined Layered QC-LDPC Decoder
Xia An, Chao Zhang 0009, Jian Song 0004, Jintao Wang 0001
ICC1
2022 Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence
Xia An, Gensong Li, Zhexuan Ren, Xing Zhang 0002, Ru Huang 0001
Sci. China Inf. Sci.2
2021 Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET
Zhexuan Ren, Xia An, Gensong Li, Xing Zhang 0002, Ru Huang 0001
Sci. China Inf. Sci.2
2021 DyTAN: Dynamic Ternary Content Addressable Memory Using Nanoelectromechanical Relays
abstract
Ternary content addressable memory (TCAM) is one type of associative memory and has been widely used in caches, routers, and many other mapping-aware applications. While the conventional SRAM-based TCAM is high speed and bulky, there have been denser but slower and less reliable nonvolatile TCAMs using nonvolatile memory (NVM) devices. Meanwhile, some CMOS TCAMs using dynamic memories have been also proposed. Although dynamic TCAM could be denser than the 16T SRAM TCAM and more reliable than the nonvolatile TCAMs, CMOS dynamic TCAMs still suffer from the row-by-row refresh energy and time overheads. In this article, we propose dynamic TCAM using nanoelectromechanical (NEM) relays (DyTAN), and utilize one-shot refresh (OSR) to solve the memory refresh problem. By exploiting the unique NEM relay characteristics, DyTAN outperforms the existing works in the balance between density, speed, and power efficiency. Compared with the 16T SRAM-based TCAM, the 5T CMOS dynamic TCAM, the 2T2R TCAM, and the 2FeFET TCAM, evaluations show that the proposed DyTAN reduces the write energy by up to$2.3\times $,$1.3\times $,$131\times $, and$13.5\times $, and improves the search energy-delay-product (EDP) by up to$12.7\times $,$1.7\times $,$1.3\times $, and$2.8\times $, respectively.
Hongtao Zhong, Shengjie Cao, Li Jiang 0002, Xia An, Narayanan Vijaykrishnan, Yongpan Liu, Huazhong Yang, Xueqing Li 0002
IEEE Trans. Very Large Scale Integr. Syst.4
2020 Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors
Xiaoqiao Dong, Wanrong Zhang 0002, Yuancheng Yang, Xia An
Sci. China Inf. Sci.9
2019 Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields
Baotong Zhang, Yuancheng Yang, Qifeng Cai, Shijie Hu, Xia An, Ru Huang 0001
Sci. China Inf. Sci.9
2018 GeC film with high substitutional carbon concentration formed by ion implantation and solid phase epitaxy for strained Ge n-MOSFETs
Bingxin Zhang, Xia An, Xiangyang Hu, Xing Zhang 0002, Ru Huang 0001
Sci. China Inf. Sci.2
2018 Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology
Bingxin Zhang, Xia An, Pengqiang Liu, Xiangyang Hu, Xing Zhang 0002, Ru Huang 0001
Sci. China Inf. Sci.2
2017 Benchmarking TFET from a circuit level perspective: Applications and guideline
abstract
Low power applications have led to a boom in researches on new circuits based on steep-slope transistors, of which the objective is to overcome MOSFET's drawback of inevitable increasing leakage power while maintaining acceptable performance in low voltage operation. Among those emerging transistors, Tunnel FET (TFET) becomes a most promising one due to its low off current and compatibility with CMOS process. In order to guide the application and the improvement of TFET, in this paper from a circuit-level perspective, utilizing a newly defined benchmarking method, we figured out the frequency-VDD range in which Si TFET circuits show low power advantage over their MOSFET counterparts based on HSPICE simulations using calibrated compact model. A systematic and quantitative analysis was then conducted to further enlarge the application scope of TFET circuits, with a Figure of Merit (FOM) and a guideline for future TFET proposed.
Lingyi Guo, Le Ye, Libo Yang, Zhu Lv, Xia An, Ru Huang 0001
ISCAS7
2015 Ge surface passivation by GeO2 fabricated by N2O plasma oxidation
Xia An, Quanxin Yun, Pengqiang Liu, Xing Zhang 0002, Ru Huang 0001
Sci. China Inf. Sci.2
2009 Challenges of 22 nm and beyond CMOS technology
Ru Huang 0001, HanMing Wu, Jinfeng Kang, Deyuan Xiao, XueLong Shi, Xia An, Runsheng Wang, Xing Zhang 0002, Yangyuan Wang
Sci. China Ser. F Inf. Sci.6