Demo Data from EDBT 2026 / reviewers in the wild / expert
Xia An
dblp:63/7419
· DBLP profile ↗
11ranked-venue papers
1as first author
4since 2021 · last 2026
0009-0008-4395-1742ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 8 · 2 since 2021Systems, architecture and hardware · 2 · 1 since 2021Computer networks · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
8 papers |
Integrated circuit design · 56% Hardware reliability and fault tolerance · 36% Memory systems · 8% |
Topics — the 13 heaviest of 14, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
semiconductor device fabrication |
0.9 | 3 | 2018 | Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology · Sci. China Inf. Sci. 2018 GeC film with high substitutional carbon concentration formed by ion implantation and solid phase epitaxy for strained Ge n-MOSFETs · Sci. China Inf. Sci. 2018 Ge surface passivation by GeO2 fabricated by N2O plasma oxidation · Sci. China Inf. Sci. 2015 |
Hardware reliability and fault tolerance › soft errors
single event transient |
0.6 | 1 | 2022 | Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence · Sci. China Inf. Sci. 2022 |
Hardware reliability and fault tolerance
soft errors |
0.6 | 1 | 2022 | Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence · Sci. China Inf. Sci. 2022 |
Hardware reliability and fault tolerance › radiation effects
total ionizing dose effects |
0.5 | 1 | 2021 | Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET · Sci. China Inf. Sci. 2021 |
Integrated circuit design
digital circuit design |
0.4 | 1 | 2020 | Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020 |
Integrated circuit design › semiconductor device modeling
transistor modeling |
0.4 | 1 | 2020 | Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020 |
Memory systems › non-volatile memory
resistive memory |
0.4 | 1 | 2019 | Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields · Sci. China Inf. Sci. 2019 |
Integrated circuit design › semiconductor devices › field-effect transistor
MOSFET |
0.1 | 1 | 2021 | Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET · Sci. China Inf. Sci. 2021 |
Integrated circuit design › analog and mixed-signal circuits
device modeling |
0.1 | 1 | 2020 | Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors · Sci. China Inf. Sci. 2020 |
Integrated circuit design
low-power circuit design |
0.1 | 1 | 2019 | Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields · Sci. China Inf. Sci. 2019 |
Integrated circuit design › semiconductor device fabrication
CMOS technology |
0.1 | 1 | 2009 | Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009 |
Integrated circuit design
technology scaling |
0.1 | 1 | 2009 | Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009 |
Integrated circuit design › semiconductor devices › device scaling
CMOS scaling limits |
0.0 | 1 | 2009 | Challenges of 22 nm and beyond CMOS technology · Sci. China Ser. F Inf. Sci. 2009 |
Methods — techniques the papers use, named apart from their topics
pulse laser testing · 0.6solid phase epitaxy · 0.3nitrogen plasma pretreatment · 0.3ion implantation · 0.3plasma oxidation · 0.2survey · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Deep Reinforcement Learning Aided Scheduling Design for Pipelined Layered QC-LDPC Decoder
Xia An, Chao Zhang 0009, Jian Song 0004, Jintao Wang 0001 |
ICC | 1 |
| 2022 | Single event transients induced by pulse laser in Ge pMOSFETs and its supply voltage dependence
Xia An, Gensong Li, Zhexuan Ren, Xing Zhang 0002, Ru Huang 0001 |
Sci. China Inf. Sci. | 2 |
| 2021 | Layout dependence of total-ionizing-dose response in 65-nm bulk Si pMOSFET
Zhexuan Ren, Xia An, Gensong Li, Xing Zhang 0002, Ru Huang 0001 |
Sci. China Inf. Sci. | 2 |
| 2021 | DyTAN: Dynamic Ternary Content Addressable Memory Using Nanoelectromechanical RelaysabstractTernary content addressable memory (TCAM) is one type of associative memory and has been widely used in caches, routers, and many other mapping-aware applications. While the conventional SRAM-based TCAM is high speed and bulky, there have been denser but slower and less reliable nonvolatile TCAMs using nonvolatile memory (NVM) devices. Meanwhile, some CMOS TCAMs using dynamic memories have been also proposed. Although dynamic TCAM could be denser than the 16T SRAM TCAM and more reliable than the nonvolatile TCAMs, CMOS dynamic TCAMs still suffer from the row-by-row refresh energy and time overheads. In this article, we propose dynamic TCAM using nanoelectromechanical (NEM) relays (DyTAN), and utilize one-shot refresh (OSR) to solve the memory refresh problem. By exploiting the unique NEM relay characteristics, DyTAN outperforms the existing works in the balance between density, speed, and power efficiency. Compared with the 16T SRAM-based TCAM, the 5T CMOS dynamic TCAM, the 2T2R TCAM, and the 2FeFET TCAM, evaluations show that the proposed DyTAN reduces the write energy by up to$2.3\times $,$1.3\times $,$131\times $, and$13.5\times $, and improves the search energy-delay-product (EDP) by up to$12.7\times $,$1.7\times $,$1.3\times $, and$2.8\times $, respectively. Hongtao Zhong, Shengjie Cao, Li Jiang 0002, Xia An, Narayanan Vijaykrishnan, Yongpan Liu, Huazhong Yang, Xueqing Li 0002 |
IEEE Trans. Very Large Scale Integr. Syst. | 4 |
| 2020 | Effective gate length model for asymmetrical gate-all-around silicon nanowire transistors
Xiaoqiao Dong, Wanrong Zhang 0002, Yuancheng Yang, Xia An |
Sci. China Inf. Sci. | 9 |
| 2019 | Low power and high uniformity of HfO x -based RRAM via tip-enhanced electric fields
Baotong Zhang, Yuancheng Yang, Qifeng Cai, Shijie Hu, Xia An, Ru Huang 0001 |
Sci. China Inf. Sci. | 9 |
| 2018 | GeC film with high substitutional carbon concentration formed by ion implantation and solid phase epitaxy for strained Ge n-MOSFETs
Bingxin Zhang, Xia An, Xiangyang Hu, Xing Zhang 0002, Ru Huang 0001 |
Sci. China Inf. Sci. | 2 |
| 2018 | Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology
Bingxin Zhang, Xia An, Pengqiang Liu, Xiangyang Hu, Xing Zhang 0002, Ru Huang 0001 |
Sci. China Inf. Sci. | 2 |
| 2017 | Benchmarking TFET from a circuit level perspective: Applications and guidelineabstractLow power applications have led to a boom in researches on new circuits based on steep-slope transistors, of which the objective is to overcome MOSFET's drawback of inevitable increasing leakage power while maintaining acceptable performance in low voltage operation. Among those emerging transistors, Tunnel FET (TFET) becomes a most promising one due to its low off current and compatibility with CMOS process. In order to guide the application and the improvement of TFET, in this paper from a circuit-level perspective, utilizing a newly defined benchmarking method, we figured out the frequency-VDD range in which Si TFET circuits show low power advantage over their MOSFET counterparts based on HSPICE simulations using calibrated compact model. A systematic and quantitative analysis was then conducted to further enlarge the application scope of TFET circuits, with a Figure of Merit (FOM) and a guideline for future TFET proposed. Lingyi Guo, Le Ye, Libo Yang, Zhu Lv, Xia An, Ru Huang 0001 |
ISCAS | 7 |
| 2015 | Ge surface passivation by GeO2 fabricated by N2O plasma oxidation
Xia An, Quanxin Yun, Pengqiang Liu, Xing Zhang 0002, Ru Huang 0001 |
Sci. China Inf. Sci. | 2 |
| 2009 | Challenges of 22 nm and beyond CMOS technology
Ru Huang 0001, HanMing Wu, Jinfeng Kang, Deyuan Xiao, XueLong Shi, Xia An, Runsheng Wang, Xing Zhang 0002, Yangyuan Wang |
Sci. China Ser. F Inf. Sci. | 6 |