Design for manufacturability rule evaluation using manufactured silicon (DREAMS) is a comprehensive methodology for evaluating the yield-preserving capabilities of a set of design for manufacturability (DFM) rules using the results of logic diagnosis performed on failed ICs. DREAMS is an improvement over prior art in that the distribution of rule violations over the diagnosis candidates and the entire design are taken into account along with the nature of the failure (e.g., bridge versus open) to appropriately weight the rules. Silicon and simulation results demonstrate the efficacy of the DREAMS methodology. Specifically, virtual data is used to demonstrate that the DFM rule most responsible for failure can be reliably identified even in light of the ambiguity inherent to a nonideal diagnostic resolution, and a corresponding rule-violation distribution that is counter-intuitive. We also show that the combination of physically aware diagnosis and the nature of the violated DFM rule can be used together to improve rule evaluation even further. Application of DREAMS to the diagnostic results from an in-production chip provides valuable insight in how specific DFM rules improve yield (or not) for a given design manufactured in particular facility. Finally, we also demonstrate that a significant artifact of DREAMS is a dramatic improvement in diagnostic resolution. This means that in addition to identifying the most ineffective DFM rule(s), validation of that outcome via physical failure analysis of failed chips can be eased due to the corresponding improvement in diagnostic resolution.

DREAMS (DFM Rule EvAluation using Manufactured Silicon) is a comprehensive methodology for evaluating the yield-preserving capabilities of a set of DFM (design for manufacturability) rules using the results of logic diagnosis performed on failed ICs. DREAMS is an improvement over prior art in that the distribution of rule violations over the diagnosis candidates and the entire design are taken into account along with the nature of the failure (e.g., bridge versus open) to appropriately weight the rules. Silicon and simulation results demonstrate the efficacy of the DREAMS methodology. Specifically, virtual data is used to demonstrate that the DFM rule most responsible for failure can be reliably identified even in light of the ambiguity inherent to a nonideal diagnostic resolution, and a corresponding rule-violation distribution that is counter-intuitive. We also show that the combination of physically-aware diagnosis and the nature of the violated DFM rule can be used together to improve rule evaluation even further. Application of DREAMS to the diagnostic results from an in-production chip provides valuable insight in how specific DFM rules improve yield (or not) for a given design manufactured in particular facility. Finally, we also demonstrate that a significant artifact of DREAMS is a dramatic improvement in diagnostic resolution. This means that in addition to identifying the most ineffective DFM rule(s), validation of that outcome via physical failure analysis of failed chips can be eased due to the corresponding improvement in diagnostic resolution.

This paper proposes a vision for a new research domain emerging on the interface between design and manufacturing of VLSI circuits. The key objective of this domain is the minimization of the mismatch between design and manufacturing which is rapidly growing with the increase in complexity of VLSI designs and IC technologies. This broad objective is partitioned into a number of specific tasks. Often, one of the most important tasks is the extraction of VLSI design attributes that may be relevant from a manufacturing efficiency standpoint. The second task is yield analysis performed to detect process and design attributes responsible for inadequate yield. This paper postulates both, an overall change in the design-manufacturing interface, as well as a methodology to address the growing design-manufacturing mismatch. Attributes of a number of tools needed for this purpose are discussed as well.

For pt. I see ibid., p. 550-6 (1998). This paper illustrates via examples problems at the design-manufacturing interface that exist in the IC industry today, and the ability of the YAN/PODEMA framework in solving these problems. The need for further development of the framework is also emphasized.

Owing to rapid changes of IC technologies, traditionaldesign rule checking is becoming inadequate to assure satisfactorylevels of IC manufacturability. This paper describes a newcomputer supported design analysis environment that improvesthe efficiency of manufacturability assessment of new products.This environment, called MAPEX 2, is described in the paperalong with some of its key procedures and algorithms. Illustrationsof MAPEX 2 applications and performance figures are provided as well.

Despite a substantial amount of prior work in design-for-testability (DFT) cost modeling, the decision whether or not and how to use DFT is still not an easy one. The problem is that the relationship between DFT benefits and costs are still far from being well understood. The objective of this paper is to study the DFT decision-making process and to identify its missing or weak links. The first step of this study involved development of a new DFT cost/benefit trade-off modeling procedure. Next, the developed cost model (which we call the CMU Test Cost model) was used, with a range of parameters representing typical industrial conditions, to answer the question: to DFT or not to DFT. The obtained results indicate that in the DFT application space there exist regions in which one can provide a clear answer to this question. There also exist regions of uncertainty. One of the objectives of our study has been to identify ways of minimizing this uncertain region.

Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.

In a typical approach to VLSI testing, open faults are modeled by the transistor-stuck-open fault model or are not explicitly covered at all. It is shown that functional faults caused by opens, i.e. by regions with missing material, cannot be modeled well by a transistor stuck-open. It is also shown that the majority of opens which occur in CMOS static circuits manifest themselves as timing faults. The analysis of the behavior of a CMOS transistor with a floating gate indicates it acts as a weakly 'on' active load, and therefore an open gate cannot be detected by stuck-fault testing but could be detected by monitoring the static current through the power buses.>