Demo Data from EDBT 2026 / reviewers in the wild / expert
Chun-Tsong Wang
dblp:64/6763
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2002
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Artificial intelligence and machine learning · 1Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Performance modeling and evaluation · 87% Electronic design automation · 13% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Performance modeling and evaluation › simulation › discrete-event simulation
petri net simulation |
0.0 | 1 | 2002 | Modeling and Performance Evaluation for Automated Material Handling Systems in a 300mm Foundry Fab · ICRA 2002 |
Performance modeling and evaluation
simulation |
0.0 | 1 | 2002 | Modeling and Performance Evaluation for Automated Material Handling Systems in a 300mm Foundry Fab · ICRA 2002 |
Electronic design automation
semiconductor manufacturing |
0.0 | 1 | 2002 | Modeling and Performance Evaluation for Automated Material Handling Systems in a 300mm Foundry Fab · ICRA 2002 |
Methods — techniques the papers use, named apart from their topics
virtual tool group · 0.0distributed colored timed petri net · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2002 | Modeling and Performance Evaluation for Automated Material Handling Systems in a 300mm Foundry FababstractA modeling methodology for conceptual design of an automated material handling system using a distributed colored timed Petri net (DCTPN) is developed. The IC fabrication process-flow model is constructed and integrated with AMHS models. In IC fabrication process-flow modeling, a method called virtual tool group is proposed to solve the problem in modeling tool-coupling effects. From this entire fab model, several performance indexes, such as WIP, bottleneck detection, cycle time, wafer operation history tracking, and vehicle utilization can be evaluated from the DCTPN simulation result. Han-Pang Huang, Chun-Tsong Wang |
ICRA | 2 |