Demo Data from EDBT 2026 / reviewers in the wild / expert
Patrick Pons
dblp:69/1202
· DBLP profile ↗
1ranked-venue papers
0as first author
1since 2021 · last 2024
0000-0002-7989-3272ORCID · verified
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer graphics and multimedia
1 paper |
Computational fabrication · 100% | |
| Computer networks
1 paper |
Physical-layer communications · 100% |
Topics — the 2 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Computational fabrication
additive manufacturing |
0.8 | 1 | 2024 | 3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave Components · Proc. IEEE 2024 |
Physical-layer communications
microwave components |
0.8 | 1 | 2024 | 3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave Components · Proc. IEEE 2024 |
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2024 | 3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave ComponentsabstractThis article presents an overview of 3-D-printed microwave and millimeter-wave components integrating gallium-based (Ga-based) liquid metal (LM). The LM is considered here as a fourth degree of freedom for the design of 3-D-printed antennas, filters, and wireless sensors. The 3-D printing combined with LM technology can be considered as a 4-D printing technology. It can benefit from the advantages offered by 3-D printing technologies (low cost and fast manufacturing) and LM at room temperature (flexibility and reconfigurability). To date, in microwave and millimeter-wave applications, 4-D printing technology is mainly used to achieve the metallization and/or reconfigurability and/or mechanical flexibility of high-frequency 3-D-printed components. Hervé Aubert, Dominique Henry, Patrick Pons |
Proc. IEEE | 3 |