On-chip memory organization is one of the most important aspects that can influence the overall system behavior in multi-processor systems. Following the trend set by high-performance processors, high-end embedded cores are moving from single-level on chip caches to a two-level on-chip cache hierarchy. Whereas in the embedded world there is general consensus on L1 private caches, for L2 there is still not a dominant architectural paradigm. Cache architectures that work for high performance computers turn out to be inefficient for embedded systems (mainly due to power-efficiency issues). This paper presents a virtual platform for design space exploration of L2 cache architectures in low-power Multi-Processor-Systems-on-Chip (MPSoCs). The tool contains several L2 caches templates, and new architectures can be easily added using our flexible plugin system. Given a set of constrains for a specific system (power, area, performance), our tool will perform extensive exploration to find the cache organization that best suits our needs. Through some practical experiments, we show how it is possible to select the optimal L2 cache, and how this kind of tool can help designers avoid some common misconceptions. Benchmarking results in the experiments section will show that for a case study with multiple processors running communicating tasks allocated on different cores, the private L2 cache organization still performs better than the shared one.

Continuous transistor scaling due to improvements in CMOS devices and manufacturing technologies is increasing processor power densities and temperatures; thus, creating challenges to maintain manufacturing yield rates and reliable devices in their expected lifetimes for latest nanometer-scale dimensions. In fact, new system and processor microarchitectures require new reliability-aware design methods and exploration tools that can face these challenges without significantly increasing manufacturing cost, reducing system performance or imposing large area overheads due to redundancy. In this paper we overview the latest approaches in reliability modeling and variability-tolerant design for latest technology nodes, and advocate the need of reliability- aware design for forthcoming consumer electronics. Moreover, we illustrate with a case study of an embedded processor that effective reliability-aware design can be achieved in nanometer-scale devices through integral design approaches that covers modeling and exploration of reliability effects, and hardware-software architectural techniques to provide reliability-enhanced solutions at both microarchitectural- and system-level.

Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power density, which may lead to thermal runaway if coupled with low-cost packaging and cooling. Hence, mechanisms to efficiently evaluate the effectiveness of advanced thermal-aware operating-system (OS) strategies (e.g. task migration) onto the available MPSoC hardware are needed. In this paper, we propose a new MPSoC OS emulation framework that enables the study of thermal management strategies at the architectural- and OS-levels with the help of a standard FPGA. This framework includes the hardware and software components needed to accurately model complex MPSoCs architectures, and to test the effects of run-time thermal management strategies at the OS/middleware level with real-life inputs. Our results show that migration overhead is negligible w.r.t. temperature timings, enabling the development of thermal-aware migration strategies. Moreover, the effectiveness of the monitoring and feedback mechanism provides an emulation performance only ten times slower than real time.

New tendencies envisage multiprocessor systems-on-chips (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video) while meeting additional design constraints (energy consumption, time-to-market). Moreover, the rise of temperature in the die for MPSoCs can seriously affect their final performance and reliability. In this article, we present a new hardware-software emulation framework that allows designers a complete exploration of the thermal behavior of final MPSoC designs early in the design flow. The proposed framework uses FPGA emulation as the key element to model hardware components of the considered MPSoC platform at multimegahertz speeds. It automatically extracts detailed system statistics that are used as input to our software thermal library running in a host computer. This library calculates at runtime the temperature of on-chip components, based on the collected statistics from the emulated system and final floorplan of the MPSoC. This enables fast testing of various thermal management techniques. Our results show speedups of three orders of magnitude compared to cycle-accurate MPSoC simulators.

With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor System-On-Chip (MPSoC) architectures have become widespread. These new systems are complex to design as they must execute multiple complex applications (e.g. video processing, 3D games), while meeting additional design constraints (e.g. energy consumption or time-to-market). Moreover, the rise of temperature in the die for MPSoC components can seriously affect their final performance and reliability. Therefore, mechanisms to efficiently evaluate complete HW/SW MPSoC designs in terms of energy consumption, temperature, performance and other key metrics are needed. In this paper, we present a new HW/SW FPGA-based emulation framework that allows designers to rapidly extract a number of critical statistics from processing cores, memories and interconnection systems being emulated on a FPGA. This information is then used to interact in real-time with a SW thermal model running on a host computer via an Ethernet port. The results show speed-ups of three orders of magnitude compared to cycle-accurate MPSoC simulators, which enable a very fast exploration of a large range of MPSoC design alternatives at the cycle-accurate level. Finally, our HW/SW framework allows designers to test run-time thermal management strategies with real-life inputs without any loss in the performance of the emulated system.

With the growing complexity in consumer embedded products and the improvements in process technology, multiprocessor system-on-chip (MPSoC) architectures have become widespread. These new systems are very complex to design as they must execute multiple complex real-time applications (e.g. video processing, or videogames), while meeting several additional design constraints (e.g. energy consumption or time-to-market). Therefore, mechanisms to efficiently explore the different possible HW-SW design interactions in complete MPSoC systems are in great need. In this paper, we present a new FPGA-based emulation framework that allows designers to rapidly explore a large range of MPSoC design alternatives at the cycle-accurate level. Our results show that the proposed framework is able to extract a number of critical statistics from processing cores, memory and interconnection systems, with a speed-up of three orders of magnitude compared to cycle-accurate MPSoC simulators