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I. Tottori

dblp:71/1303 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 1995
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 100%

Topics — the 1 heaviest of 1, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › technology computer-aided design
process and device simulation
0.011995
3-D numerical modeling of thermal flow for insulating thin film using surface diffusion · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1995

Methods — techniques the papers use, named apart from their topics

finite-difference numerical modeling · 0.0
YearPublicationVenuePosition
1995 3-D numerical modeling of thermal flow for insulating thin film using surface diffusion
abstract
This paper presents a three-dimensional (3-D) numerical surface diffusion model of BPSG glass flow of surface tension. The analysis region is divided into small cubic cells. Material surface is described as an equi-concentration (equi-existence rate) area which is obtained by linear interpolation between the cells. 3-D surface curvature is defined as the ratio of the increment of surface area to that of volume in a small interface area. Flux of flow is proportional to gradient of the surface curvature, and the direction is from positions of larger curvature to that of small curvature. The flow algorithm is that particles move from the mass-center of the equi-concentration area of a cell to that of the neighbor cells across the contact lines of the cell boundary and the equi-concentration area. This paper presents two 3-D simulations of flow which show that this model can be applied for not only cylindrical symmetry but also general 3-D topography. Also, the surface diffusion coefficient for the total concentration (C/sub imp/: P/sub 2/O/sub 5/ and B/sub 2/O/sub 3/) is derived using the model by fitting 2-D simulations to the experiments at 850/spl deg/C.>
Masato Fujinaga, I. Tottori, Tatsuya Kunikiyo, Tetsuya Uchida, Norihiko Kotani, Yasumasa Tsukamoto
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2