EDBT 2026 Demo / reviewers in the wild / expert
L. Bergonzi
dblp:71/4103
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 1987
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 100% | |
| Theoretical computer science
1 paper |
Mathematical optimization · 100% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › physical design › placement › module placement
block placement |
0.0 | 1 | 1987 | Thermodynamic Optimization of Block Placement · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1987 |
Electronic design automation
physical design |
0.0 | 1 | 1987 | Thermodynamic Optimization of Block Placement · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1987 |
Electronic design automation › physical design › placement
simulated annealing placement |
0.0 | 1 | 1987 | Thermodynamic Optimization of Block Placement · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1987 |
Mathematical optimization
combinatorial optimization |
0.0 | 1 | 1987 | Thermodynamic Optimization of Block Placement · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1987 |
Methods — techniques the papers use, named apart from their topics
thermodynamic optimization · 0.0simulated annealing · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1987 | Thermodynamic Optimization of Block PlacementabstractThis paper presents the results of a systematic investigation of the thermodynamic ("simulated annealing") method applied to the placement of rectangular blocks on a chip. A new presentation of the fundamental ideas underlying this technique is proposed. It is shown that the analogies with physics, which have been at the origin of the method, may be partially forgotten, but that they are still useful to understand some results. Several simple examples are investigated, and the influence of various parameters is studied. Typical complex industrial applications are subsequently presented. Finally, an interactive implementation of the thermodynamic optimization algorithm, based on the results of the present investigation, is proposed. Patrick Siarry, L. Bergonzi, Gérard Dreyfus |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |