Qing Zhu 0013

dblp:74/963-13 · DBLP profile ↗
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5ranked-venue papers
1as first author
5since 2021 · last 2025
0000-0002-3929-7150ORCID · verified

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 5 · 1 first-author · 5 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
5 papers
Integrated circuit design · 72% Hardware reliability and fault tolerance · 28%
Computer networks
1 paper
Physical-layer communications · 100%

Topics — the 6 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
analog and mixed-signal circuits
2.232025
High linearity GaN HEMT by optimized three-dimensional-gated modulation via top-MIS-gate nanowire channel structure · Sci. China Inf. Sci. 2025
A novel multi-threshold coupling InAlN/GaN double-channel HEMT for improving transconductance flatness · Sci. China Inf. Sci. 2024
Improved transport properties and mechanism in recessed-gate InAlN/GaN HEMTs using a self-limited surface restoration method · Sci. China Inf. Sci. 2022
Hardware reliability and fault tolerance
device reliability
0.812024
Realtime observation of "spring fracture" like AlGaN/GaN HEMT failure under bias · Sci. China Inf. Sci. 2024
Hardware reliability and fault tolerance › aging
transistor aging
0.712023
Degradation induced by holes in Si3N4/AlGaN/GaN MIS HEMTs under off-state stress with UV light · Sci. China Inf. Sci. 2023
Integrated circuit design › semiconductor devices › heterostructure devices
high electron mobility transistor
0.612022
Improved transport properties and mechanism in recessed-gate InAlN/GaN HEMTs using a self-limited surface restoration method · Sci. China Inf. Sci. 2022
Integrated circuit design › semiconductor devices
semiconductor device engineering
0.212024
A novel multi-threshold coupling InAlN/GaN double-channel HEMT for improving transconductance flatness · Sci. China Inf. Sci. 2024
Integrated circuit design › semiconductor devices
semiconductor device physics
0.212024
Realtime observation of "spring fracture" like AlGaN/GaN HEMT failure under bias · Sci. China Inf. Sci. 2024

Methods — techniques the papers use, named apart from their topics

top-MIS-gate · 0.9three-dimensional-gated modulation · 0.9TCAD simulation · 0.8off-state stress · 0.7UV light stress · 0.7
YearPublicationVenuePosition
2025 High linearity GaN HEMT by optimized three-dimensional-gated modulation via top-MIS-gate nanowire channel structure
Can Gong, Minhan Mi, Yuwei Zhou, Hanzhen Li, Xinyi Wen, Sirui An, Xiang Du, Qing Zhu 0013, Xiaohua Ma 0001, Yue Hao 0001
Sci. China Inf. Sci.12
2024 A novel multi-threshold coupling InAlN/GaN double-channel HEMT for improving transconductance flatness
Sirui An, Minhan Mi, Qing Zhu 0013, Jielong Liu, Siyin Guo, Can Gong, Xiaohua Ma 0001, Yue Hao 0001
Sci. China Inf. Sci.5
2024 Realtime observation of "spring fracture" like AlGaN/GaN HEMT failure under bias
Qing Zhu 0013, Zhenni Wang, Yuxiang Wei 0006, Ling Yang 0003, Xiaoli Lu, Jiejie Zhu, Peng Zhong, Yimin Lei, Xiaohua Ma 0001
Sci. China Inf. Sci.1
2023 Degradation induced by holes in Si3N4/AlGaN/GaN MIS HEMTs under off-state stress with UV light
Qing Zhu 0013, Jiejie Zhu, Minhan Mi, Yuwei Zhou, Ziyue Zhao 0003, Xiaohua Ma 0001, Yue Hao 0001
Sci. China Inf. Sci.2
2022 Improved transport properties and mechanism in recessed-gate InAlN/GaN HEMTs using a self-limited surface restoration method
Xiaohua Ma 0001, Jiejie Zhu, Minhan Mi, Jingshu Guo, Jielong Liu, Qing Zhu 0013, Ling Yang 0003, Yue Hao 0001
Sci. China Inf. Sci.8