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Bo-Wei Hsieh

dblp:83/4926 · DBLP profile ↗
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4ranked-venue papers
4as first author
0since 2021 · last 2007
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 2 · 2 first-authorSystems, architecture and hardware · 2 · 2 first-authorApplied, interdisciplinary, general and emerging computing · 2 · 2 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
3 papers
Performance modeling and evaluation · 95% Embedded and real-time systems · 5%
Theoretical computer science
2 papers
Mathematical optimization · 100%

Topics — the 4 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Performance modeling and evaluation › simulation › discrete-event simulation
scheduling simulation
0.132003
Efficient Selection of Scheduling Rule Combination by Combining Design of Experiment and Ordinal Optimization-Based Simulation · ICRA 2003
Scheduling semiconductor wafer fabrication by using ordinal optimization-based simulation · IEEE Trans. Robotics Autom. 2001
Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication · ICRA 2001
Performance modeling and evaluation
semiconductor wafer fabrication
0.122003
Efficient Selection of Scheduling Rule Combination by Combining Design of Experiment and Ordinal Optimization-Based Simulation · ICRA 2003
Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication · ICRA 2001
Mathematical optimization › black-box optimization
ordinal optimization
0.122003
Efficient Selection of Scheduling Rule Combination by Combining Design of Experiment and Ordinal Optimization-Based Simulation · ICRA 2003
Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication · ICRA 2001
Embedded and real-time systems
real-time scheduling
0.012001
Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication · ICRA 2001

Methods — techniques the papers use, named apart from their topics

ordinal optimization · 0.2discrete-event simulation · 0.1design of experiments · 0.1optimal computing budget allocation · 0.0
YearPublicationVenuePosition
2007 Efficient Simulation-Based Composition of Scheduling Policies by Integrating Ordinal Optimization With Design of Experiment
abstract
Semiconductor wafer fab operations are characterized by complex and reentrant production processes over many heterogeneous machine groups with stringent performance requirements. Efficient composition of good scheduling policies from combinatorial options of wafer release and machine dispatching rules has posed a significant challenge to competitive fab operations. In this paper, we design a fast simulation-based methodology by an innovative integration of ordinal optimization (OO) and design of experiments (DOEs) to efficiently select a good scheduling policy for fab operations. Instead of finding the exact performance among scheduling policies, our approach compares their relative orders of performance to a specified level of confidence. Our new approach consists of three stages: performance estimation model construction using DOE, policy option screening process, and final simulation evaluation with intelligent computing budget allocation. The exponential convergence of OO is integrated into all the three stages to significantly improve computational efficiency. Simulation results of applications to scheduling wafer fabrications not only screen out good scheduling policies but also provide insights about how factors such as wafer release and the dispatching of each machine group may affect production cycle times and smoothness under a reentrant process flow. Most of the OO-based DOE simulations require 2-3 orders of magnitude less computation time than those of a traditional approach. Such a high speedup enables decision makers to explore much larger problems.Note to Practitioners- This paper designs a fast simulation-based methodology to compose a good scheduling policy from various dispatching rules of fab operations. The methodology innovatively applies DOE to estimate performance of dispatching rule combinations (policies) over various machines groups in a fab, screens out good enough policy options by using OO over the performance estimation, and allocates computation time intelligently to simulate potentially good options. Our study shows that OO-based DOE simulations require 2-3 orders of magnitude less computation time than those of a traditional approach. The high speedup enables fab managers to identify good scheduling policies from the many combinations of wafer release and dispatching rules.
Bo-Wei Hsieh, Chun-Hung Chen, Shi-Chung Chang
IEEE Trans Autom. Sci. Eng.1
2003 Efficient Selection of Scheduling Rule Combination by Combining Design of Experiment and Ordinal Optimization-Based Simulation
abstract
In a fab with heterogeneous machine groups, the number of scheduling policies grows in a combinatorial way because each machine group has its specific dispatching rules. In this paper, we design a fast simulation methodology by an innovative combination of the notions of ordinal optimization (OO) and design of experiments (DOE) to efficiently select a good scheduling policy for fab operation, Instead of finding the exact performance among scheduling policies, our approach compares their relative orders of performance to a specified level of confidence. The DOE method is exploited to largely reduce the number of scheduling policies to be evaluated by the OO-based simulation. Simulation results of applications to scheduling wafer fabrications show that most of the OO-based DOE simulations require 2 to 3 orders of magnitude less computation time than those of traditional approach, and the speedup is up to 7,000 times in certain cases.
Bo-Wei Hsieh, Shi-Chung Chang, Chun-Hung Chen
ICRA1
2001 Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication
abstract
We exploit the speed of an ordinal optimization (OO)-based simulation tool designed by Hsieh et al. (1999) to investigate dynamic selection of scheduling rules for semiconductor wafer fabrication (FAB). Although a scheduling rule is a combination of loading wafer release and dispatching rules, this paper specifically focuses on dispatching when significant amount of wafers-in-process are held due to engineering causes and when major machine failures occur. Four prominent dispatching rules combined with the wafer release policy of workload regulation constitute a basic set of rule options. The dispatching rule may be weekly selected based on FAB states over a four-week horizon. A total of 756 rule options are then evaluated and ranked by the OO-based simulation tool under the performance index of mean cycle time and throughput rate. Results demonstrate the value of dynamic rule selection for uncertainty handling, the insightful selection of good rules and the needs for further research.
Bo-Wei Hsieh, Shi-Chung Chang, Chun-Hung Chen
ICRA1
2001 Scheduling semiconductor wafer fabrication by using ordinal optimization-based simulation
abstract
Computational efficiency is one of the major challenges of applying simulation to short-term operation scheduling of semiconductor wafer fabrication factories (fabs), which are characterized by re-entrant process flows, stringent production control requirements and fast changing technology and business environments. The paper explores the application of the ordinal optimization (OO)-based simulation technique to efficiently selecting good rules for scheduling wafer fabrications. An efficient simulation tool, which makes use of OO and optimal computing budget allocation techniques, is developed. Experiments with the OO-based simulation tool are conducted for static selection of good rules under different factors such as initial state, performance index and time horizon. Results indicate that one to two orders of computation time reduction over traditional simulations can be achieved and that what rules are good varies with factors of initial state, performance index and time horizon. These results motivate our further investigation about applications to dynamic selection of dispatching rules upon the occurrence of two significant uncertain events: holding of significant amount of wafers-in-process due to engineering causes and major machine failures. Results demonstrate the value of dynamic rule selection for uncertainty handling, the insightful selection of good rules and the needs for future research.
Bo-Wei Hsieh, Chun-Hung Chen, Shi-Chung Chang
IEEE Trans. Robotics Autom.1