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Tatsuya Kunikiyo

dblp:83/664 · DBLP profile ↗
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2ranked-venue papers
1as first author
0since 2021 · last 1995
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 88% Integrated circuit design · 12%

Topics — the 1 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › technology computer-aided design
process and device simulation
0.021995
3-D numerical modeling of thermal flow for insulating thin film using surface diffusion · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1995
Reverse short-channel effect due to lateral diffusion of point-defect induced by source/drain ion implantation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1994

Methods — techniques the papers use, named apart from their topics

finite-difference numerical modeling · 0.0process simulation · 0.0device simulation · 0.0
YearPublicationVenuePosition
1995 3-D numerical modeling of thermal flow for insulating thin film using surface diffusion
abstract
This paper presents a three-dimensional (3-D) numerical surface diffusion model of BPSG glass flow of surface tension. The analysis region is divided into small cubic cells. Material surface is described as an equi-concentration (equi-existence rate) area which is obtained by linear interpolation between the cells. 3-D surface curvature is defined as the ratio of the increment of surface area to that of volume in a small interface area. Flux of flow is proportional to gradient of the surface curvature, and the direction is from positions of larger curvature to that of small curvature. The flow algorithm is that particles move from the mass-center of the equi-concentration area of a cell to that of the neighbor cells across the contact lines of the cell boundary and the equi-concentration area. This paper presents two 3-D simulations of flow which show that this model can be applied for not only cylindrical symmetry but also general 3-D topography. Also, the surface diffusion coefficient for the total concentration (C/sub imp/: P/sub 2/O/sub 5/ and B/sub 2/O/sub 3/) is derived using the model by fitting 2-D simulations to the experiments at 850/spl deg/C.>
Masato Fujinaga, I. Tottori, Tatsuya Kunikiyo, Tetsuya Uchida, Norihiko Kotani, Yasumasa Tsukamoto
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3
1994 Reverse short-channel effect due to lateral diffusion of point-defect induced by source/drain ion implantation
abstract
Presents a physical model of reverse short-channel effects on threshold voltage caused by lateral diffusion of the Frenkel pairs (interstitial-vacancy) induced by ion implantation in source/drain region of n-channel MOS devices. Based on the process and device simulation, it is shown that lateral diffusion of the Frenkel pairs enhances diffusion of channel dopant, and results in nonuniform lateral distribution. This phenomenon causes the threshold voltage increase in the short-channel devices. The authors extracted parameters on point-defect diffusion from the comparison of calculated results with experimental data on threshold voltage. Calculated arsenic profile in the source/drain region using those parameters shows good agreement with the experimental data measured by secondary ion mass spectroscopy (SIMS). The close agreement between simulation and experimental results both on the arsenic profile in source/drain region and threshold voltage confirms the validity of the model and extracted parameters.>
Tatsuya Kunikiyo, Katsuyoshi Mitsui, Masato Fujinaga, Tetsuya Uchida, Norihiko Kotani
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1