In this paper, a method of simulation and testing of MCM's thermal fields has been presented. The method is based on the MCM's structure decomposition and formalization of the problem of heat exchange simulation among the elements of a structure. The general thermal model of the structure is presented as multilevel rectangular parallelepiped with the flat and bulky heat sources with the assumption about heat exchange with the environment by the system of initial and boundary conditions. Steady-state solution of thermal simulation problem in analytical form has been obtained. The "MONSTR-M" system of MCM's thermal design is realized. Comparisons of experimental and simulated results are presented.

This paper presents a new approach to 3-dimensional thermal simulation of arbitrary electronic systems.This approach is based on the combination of numerical (finite elements and finite differences) and analytical (Fourier series) techniques which are very general and extremely efficient.Complex electronic systems (monolithic IC's, multichip modules, including their packaging) can be analyzed in minutes on PC's to produce a detailed temperature distributions within the system structure.The software system, MON-STR, has been developed and applied to several industrial examples.The results of this analysis are directly entered to the circuit simulator, HSPICE, as the actual temperature for each circuit element and thus an integrated electro-thermal simulation is performed.