EDBT 2026 Demo / reviewers in the wild / expert
Yuusuke Yamada
dblp:86/1362
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2000
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Artificial intelligence and machine learning · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 61% Emerging computing paradigms · 30% GPUs and heterogeneous computing · 9% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
3d integration |
0.0 | 1 | 2000 | Smart Vision Chip Fabricated Using Three Dimensional Integration Technology · NIPS 2000 |
Integrated circuit design › 3d integration
3D LSI |
0.0 | 1 | 2000 | Smart Vision Chip Fabricated Using Three Dimensional Integration Technology · NIPS 2000 |
Emerging computing paradigms
neuromorphic computing |
0.0 | 1 | 2000 | Smart Vision Chip Fabricated Using Three Dimensional Integration Technology · NIPS 2000 |
GPUs and heterogeneous computing
vision processing |
0.0 | 1 | 2000 | Smart Vision Chip Fabricated Using Three Dimensional Integration Technology · NIPS 2000 |
Methods — techniques the papers use, named apart from their topics
three-dimensional LSI technology · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2000 | Smart Vision Chip Fabricated Using Three Dimensional Integration TechnologyabstractThe smart VISIOn chip has a large potential for application in general purpose high speed image processing systems. In order to fabricate smart vision chips including photo detector compactly, we have proposed the application of three dimensional LSI technology for smart vision chips. Three dimensional technology has great potential to realize new neuromorphic systems inspired by not only the biological function but also the biological structure. In this paper, we describe our three dimensional LSI technology for neuromorphic circuits and the design of smart vision chips . Hiroyuki Kurino, Masaki Nakagawa, Kang Wook Lee 0002, Tomonori Nakamura, Yuusuke Yamada, Ki Tae Park, Mitsumasa Koyanagi |
NIPS | 5 |