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Walter B. Richardson

dblp:86/5333 · DBLP profile ↗
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2ranked-venue papers
1as first author
0since 2021 · last 1992
0000-0002-9569-1603ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 89% Integrated circuit design · 11%

Topics — the 6 heaviest of 6, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › technology computer-aided design
process simulation
0.021992
Modeling phosphorus diffusion in three dimensions · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992
PEPPER-a process simulator for VLSI · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989
Electronic design automation › technology computer-aided design › process simulation
dopant diffusion modeling
0.011992
Modeling phosphorus diffusion in three dimensions · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992
Electronic design automation › technology computer-aided design › process simulation
ion implantation modeling
0.011989
PEPPER-a process simulator for VLSI · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989
Electronic design automation › technology computer-aided design
monte carlo ion implantation
0.011989
PEPPER-a process simulator for VLSI · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989
Integrated circuit design
semiconductor process modeling
0.011992
Modeling phosphorus diffusion in three dimensions · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992
Integrated circuit design
VLSI technology
0.011989
PEPPER-a process simulator for VLSI · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989

Methods — techniques the papers use, named apart from their topics

method of lines · 0.0krylov projection · 0.0finite difference · 0.0backward difference formula · 0.0partial differential equation solver · 0.0monte carlo simulation · 0.0
YearPublicationVenuePosition
1992 Modeling phosphorus diffusion in three dimensions
abstract
A three-dimensional process simulator in which both the standard nonlinear diffusion model and a five-species kinetic model are implemented to model phosphorus diffusion in silicon is described. The reaction-diffusion equations are discretized using finite differences in space and the numerical method of lines. The resulting ordinary differential equations are solved using the system integrator LSODP. LSODP uses a backward difference formula for time integration and a Krylov projection method to solve the linear system in the inner Newton loop. Comparisons of the two diffusion models are run on several test problems. Results show that the Krylov approach works well for the mildly asymmetric system of the single species, but requires a large dimension (K/sub m/ approximately=20) subspace for the five-species model.>
Walter B. Richardson, Graham F. Carey, Brian J. Mulvaney
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
1989 PEPPER-a process simulator for VLSI
abstract
PEPPER is a computer program that simulates in one dimension the ion implantation, diffusion, oxidation, epitaxy, deposition, and etch processes used in VLSI technology. The program contains an efficient Monte Carlo ion implantation algorithm that includes explicit calculation of ion channeling and damage. The key feature of the diffusion calculation is a general partial differential equation solver for rapid prototyping of physical models. The solver has been used to develop several unique diffusion models. A novel model for impurity diffusion in polysilicon treats the problem as a two-stream process, with relatively slow standard diffusion within the grain and a much more rapid component of diffusion along the grain boundaries. The two components are coupled at each point by a segregation term. Two other models for impurity diffusion in silicon include explicit calculation of the coupling of point defects with impurities. One of the point-defect models is a general and detailed formulation from a chemical kinetics viewpoint, while the other makes further assumptions to simplify the model for engineering analysis.>
Brian J. Mulvaney, Walter B. Richardson, Timothy L. Crandle
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2