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Kunihiro Fujiyoshi

dblp:87/2526 · DBLP profile ↗
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23ranked-venue papers
9as first author
1since 2021 · last 2025
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 22 · 8 first-author · 1 since 2021Theory of computation · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
7 papers
Electronic design automation · 98% Reconfigurable computing and FPGAs · 2%

Topics — the 10 heaviest of 10, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
physical design
0.372009
A Tree Based Novel Representation for 3D-Block Packing · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2007
Arbitrary convex and concave rectilinear block packing usingsequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2000
Electronic design automation › physical design
floorplanning
0.132009
A Tree Based Novel Representation for 3D-Block Packing · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Arbitrary convex and concave rectilinear block packing usingsequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2000
Module packing based on the BSG-structure and IC layout applications · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998
Electronic design automation › physical design
placement
0.132007
Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2007
VLSI/PCB placement with obstacles based on sequence pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998
VLSI module placement based on rectangle-packing by the sequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Electronic design automation › physical design › placement › circuit placement
analog placement
0.112007
Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2007
Electronic design automation › physical design › placement
placement constraints
0.112007
Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2007
Electronic design automation › physical design › floorplanning
sequence-pair representation
0.132000
Arbitrary convex and concave rectilinear block packing usingsequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2000
VLSI/PCB placement with obstacles based on sequence pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998
VLSI module placement based on rectangle-packing by the sequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996
Reconfigurable computing and FPGAs
FPGA architecture
0.011997
Design of minimum and uniform bipartites for optimum connection blocks of FPGA · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1997
Electronic design automation › physical design
routing
0.011997
Design of minimum and uniform bipartites for optimum connection blocks of FPGA · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1997
Electronic design automation › physical design › routing › FPGA routing
switch box design
0.011997
Design of minimum and uniform bipartites for optimum connection blocks of FPGA · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1997
Electronic design automation › physical design
VLSI layout
0.021998
VLSI/PCB placement with obstacles based on sequence pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998
VLSI module placement based on rectangle-packing by the sequence-pair · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1996

Methods — techniques the papers use, named apart from their topics

tree encoding · 0.1simulated annealing · 0.1sequence-pair representation · 0.1linear programming · 0.1constraint graph · 0.1sequence pair adaptation · 0.0bipartite graph construction · 0.0
YearPublicationVenuePosition
2025 A Method for Selecting the Wiring Direction from Terminals using a Planar Graph Drawing Method
abstract
In the design of printed circuit boards and integrated circuits, the problem of determining the appropriate wiring direction from pins is addressed by the more complex and difficult problem of "Place and Route Puzzle." We propose a method that can always find a solution. In this method, we convert the Place and Route Puzzle into a graph, divide it into 3-vertex-connected components, and then apply a known planar drawing method to each connected component to find a solution.
Takuto Amari, Heihachirou Hasumi, Kunihiro Fujiyoshi
ISCAS3
2011 A novel representation for repeated placement
abstract
Recently, exploring repeated placements has been researched to apply on-chip processor array, which consists of the array of the same processors. This representation may also be used for the design of FPGA, scheduling of pipeline, and others. For this purpose, sequence-triple, representation for repeated placement, was proposed. However, it cannot represent a certain kind of placements but contains so many redundant codes. In this paper, we propose a novel representation method for repeated placement, which can represent any horizontal prior Horizontal-Vertical-Relation-Set. Also, we propose a decoding algorithm of the representation, which takes O(n3) time, where n is the number of rectangles in each cycle.
Kunihiro Fujiyoshi, Keisuke Ishihara, Tan Wei Liang
ISCAS1
2009 Representation of 3D-LSI Floorplan based on Stacked-rectangular-dissection
abstract
Recently, 3D-LSIs which consist of several silicon layers have been developed and have attracted attention. 3D-LSI has an advantage of the length of wires and the number of components per chip. However, a layout design of the 3D-LSIs will be much complex. In this paper, we propose a stacked-rectangular-dissection, which consists of several rectangular dissections, as a floorplan of 3D-LSI. And to search for a good floorplan of 3D-LSI with simulated annealing, a representation of a stacked-rectangular-dissection is presented.
Hidenori Ohta, Kunihiro Fujiyoshi
ISCAS2
2009 A Tree Based Novel Representation for 3D-Block Packing
abstract
The 3D packing problem consists of arranging nonoverlapping rectangular boxes (blocks) of given sizes in a rectangular box of minimum volume. As a representation of 3D packings, this paper proposes a novel encoding method called Double Tree and Sequence (DTS). The following are features of DTS: 1) It can represent any minimal packing. 2) It can be decoded into the corresponding 3D packing inO(n2) time, wherenis the number of rectangular boxes. 3) The size of the solution space (the number of codes) of DTS is significantly smaller than any conventional representation that can represent any packing. Experimental comparisons with conventional representations indicate the superiority of the proposed representation DTS.
Kunihiro Fujiyoshi, Hidenori Kawai, Keisuke Ishihara
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
2007 DTS: A Tree Based Representation for 3D-Block Packing
abstract
3D packing problem is to arrange rectangular boxes (blocks) of given sizes in a rectangular box of the minimum volume without overlapping each other. As a representation for 3D packings, this paper proposes a novel encoding method, called DTS (double tree and sequence). The feature of the DTS is: (1) It can represent any minimal packings. (2) The size of the solution space (the number of codes) of DTS is much smaller than any conventional representation which can represent any packings. Experimental comparisons with conventional representations indicate the superiority of the proposed representation DTS
Kunihiro Fujiyoshi, Hidenori Kawai, Keisuke Ishihara
ISCAS1
2007 A fast algorithm for rectilinear block packing based on selected sequence-pair
Kunihiro Fujiyoshi, Chikaaki Kodama, Akira Ikeda
Integr.1
2007 Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout
abstract
In recent high-performance analog integrated circuit design, it is often required to place some cells symmetrically to a horizontal or vertical axis. Balasa et al. proposed a method of obtaining the closest placement that satisfies the given symmetry constraints and the topology constraints imposed by a sequence-pair (seq-pair). However, this method has the following defects: 1) Balasa's necessary condition for existence of the cell placement that satisfies the given constraints is incorrect; 2) some cells overlap; 3) the closest placement of satisfying both the symmetry and topology constraints is not always obtained; and 4) there is no explanation of placing cells symmetrically to plural axes. In this paper, we clarify the necessary and sufficient conditions for the existence of the cell placement that satisfies the given symmetry constraints and the topology constraints imposed by a seq-pair, and we propose an efficient method of obtaining, by linear programming, the closest cell placement that satisfies the given constraints. Here, a simple constraint graph is obtained from a seq-pair in order to derive a set of linear constraint expressions. Then, to shorten the running time of linear programming, the number of linear expressions is reduced by substituting the expressions for dependent variables, and the solution is obtained. The effectiveness of the proposed method was shown by computational experiments
Shinichi Kouda, Chikaaki Kodama, Kunihiro Fujiyoshi
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3
2006 Evaluation of 3D-packing representations for scheduling of dynamically reconfigurable systems
abstract
In our dynamically reconfigurable system model, computation resources are arranged in 2D-plane and each partial task is assigned to computation resources of rectangle-shape for a certain time period. The problem can be regarded as a rectangular box packing problem in 3D-space of 2D-plane and time axis. However, since partial tasks have order constraints, a packing should satisfy the given order constraints. We call this problem 3D-scheduling problem. Although there have been proposed various types of rectangular box packing representation, it is not examined until now which representation is fit to 3D-scheduling problem. In this paper, we investigate features of each 3D-packing representation, and show which representation is fit to 3D-scheduling problem theoretically and experimentally
Yukihide Kohira, Chikaaki Kodama, Kunihiro Fujiyoshi, Atsushi Takahashi 0001
ISCAS3
2006 Improved method of cell placement with symmetry constraints for analog IC layout design
abstract
Recently, it is often required in high performance analog IC design that some cells are placed symmetrically to horizontal or vertical axis. Balasa et al. proposed a method of obtaining the closest placement satisfying the given symmetry constraints and the topology constraints imposed by a sequence-pair, but this method has the following defects: (1) Some cells overlap each other. (2) The closest cell placement satisfying both the symmetry and topology constraints may not be obtained. (3) How to place cells symmetrically is mentioned only for one axis and there is no explanation for plural axes. In this paper, we propose an efficient method to obtain the closest cell placement satisfying the given symmetry constraints and the topology constraints imposed by a sequence-pair using linear programming. The proposed method obtains a simple constraint graph from a sequence-pair and derives a set of linear constraint expressions from the graph. The number of linear expressions decreases by substituting the expressions for dependent variables. Then the solutions are obtained by linear programming. The effectiveness of the proposed method was shown by computational experiments.
Shinichi Kouda, Chikaaki Kodama, Kunihiro Fujiyoshi
ISPD3
2003 Selected sequence-pair: an efficient decodable packing representation in linear time using sequence-pair
abstract
In this paper, we propose selected (SSP), a sequence-pair (seq-pair) with the limited number of subsequences called adjacent crosses. Its features are: (1) The smallest packing based on a given SSP can be obtained in O(n) time, where n is the number of rectangles. (2) An arbitrary packing can be represented by SSP. (3) The total representation number of SSP of size n is not more than that of rectangular dissection of the same size with n-/spl lfloor//spl radic/(4n-1)/spl rfloor/ empty rooms (the necessary number of empty rooms to represent an arbitrary packing). To realize these features of SSP, we propose an algorithm to enumerate all adjacent crosses on a seq-pair in linear time of n + k (k is the number of adjacent crosses). Also we apply a conventional method to convert a seq-pair without adjacent crosses to an equivalent Q-sequence, representation of rectangular dissection, in O(n + k) time. A move operation to obtain an adjacent solution efficiently is proposed to perturb SSP for Simulated Annealing (SA). From experimental results, we confirmed the proposed method was carried out in linear time and was more efficient than the conventional method when SSP size got bigger.
Chikaaki Kodama, Kunihiro Fujiyoshi
ASP-DAC2
2000 Simulated annealing search through general structure floorplans using sequence-pair
abstract
VLSI floorplan is a rectangular dissection of a chip rectangle where dissection lines correspond to wiring channels and each module is assigned to a separate room. Floorplans are often represented by the slicing structures. Recently, sequence-pair (seq-pair) has been proposed as the description of the rectangle packing and later on a method to map a seq-pair to a floorplan has been proposed. However, such floorplans made of seq-pairs often include rooms with no module assigned, and so it is difficult to make good solution space by seq-pair. In this paper, we propose a novel solution space of floorplans for simulated annealing (SA) which consists of the all general floorplans with exact n rooms, where n is the number of given modules, using seq-pair. By using ingenious data structure, a feasible adjacent floorplan can be obtained in O(n/sup 2/) time and the reachability from any floorplan to any other in the proposed solution space is proved. The experimental results show the effectiveness of the solution space.
Koji Kiyota, Kunihiro Fujiyoshi
ISCAS2
2000 Arbitrary convex and concave rectilinear block packing usingsequence-pair
abstract
The sequence-pair was proposed in 1995 as a representation of the packing of rectangles of general structure. Since then, there have been efforts to expand its applicability over simple rectangles. This paper proposes a unified way to represent the packing of a set of rectilinear blocks, including arbitrary concave rectilinear blocks. Our idea is in the representation of a general block by a collection of rectangle blocks with additional constraints, Some sequence-pairs of rectangle blocks with such constraints may not be feasible, i.e., there is no corresponding parking. A necessary and sufficient condition of feasible sequence-pair is given by the properties of the horizontal and vertical constraint graphs. Furthermore, it is proved that any packing is represented by a feasible sequence-pair. The condition includes dimensions of blocks involved. If we limit the rectilinear blocks to L-shaped ones, a necessary and sufficient condition can be represented only in terms of the topology of the sequence-pair, without dimensions of blocks. A packing algorithm is designed as an SA search of the generated sequence-pairs. Experimental results show the effectiveness of the proposed method.
Kunihiro Fujiyoshi, Hiroshi Murata
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
1999 Arbitrary convex and concave rectilinear block packing using sequence-pair
abstract
The sequence-pair was proposed in 1995 as a rep- resentation of the packing of rectangles of general structure. Since then, there have been efforts to expand its applicability over simple rectangles. This paper proposes a unified way to represent the packing of a set of rectilinear blocks, including arbitrary concave rectilinear blocks. Our idea is in the repre- sentation of a general block by a collection of rectangle blocks with additional constraints. Some sequence-pairs of rectangle blocks with such constraints may not be feasible, i.e., there is no corresponding packing. A necessary and sufficient condition of feasible sequence-pair is given by the properties of the horizontal and vertical constraint graphs. Furthermore, it is proved that any packing is represented by a feasible sequence-pair. The condition includes dimensions of blocks involved. If we limit the rectilinear blocks to L-shaped ones, a necessary and sufficient condition can be represented only in terms of the topology of the sequence-pair, without dimensions of blocks. A packing algorithm is designed as an SA search of the generated sequence-pairs. Experimental results show effectiveness of the proposed method. Index Terms—Compaction, layout, packing, placement, se- quence-pair.
Kunihiro Fujiyoshi, Hiroshi Murata
ISPD1
1998 VLSI/PCB placement with obstacles based on sequence pair
abstract
In a typical very large scale integration/printed circuit board (VLSI/PCB) design, some modules are preplaced in advance, and the other modules are requested to be placed without overlap with each other and with these preplaced modules. The presence of such obstacles introduces inconsistency to a coding scheme, called sequence pair, which has been proposed for an obstacle free placement problem. We solve this difficulty by proposing a procedure called "adaptation" which transforms an inconsistent sequence pair to a consistent one with the utmost consideration for minimizing the modification. It is shown that a simulated annealing is well organized so that it tests only feasible placements by the adaptation procedure. As a design example, a Microelectronics Center of North Carolina (MCNC) benchmark data "ami49" is packed with treating ten modules among 49 modules as preplaced ones. Further, a PCB example which includes 32 free modules and four preplaced modules (connectors) is laid out successfully by our method with a conventional wiring estimation followed by a commercial router.
Hiroshi Murata, Kunihiro Fujiyoshi, Mineo Kaneko
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2
1998 Module packing based on the BSG-structure and IC layout applications
abstract
A new method of packing the rectangles is proposed with applications to integrated circuit (IC) layout design. A special work-sheet, called the bounded-sliceline grid, is introduced. It consists of special segments that dissect the plane into rooms to which binary relations "right-of" and "above" are associated such that any two rooms are uniquely in either relation. A packing is obtained through an assignment of the modules into the rooms followed by a compaction procedure. Changing the assignments by swapping the contents of two rooms, a simulated annealing strategy is implemented to search for a good packing. Empirical results show that hundreds of rectangles are packed with a quite good quality in area efficiency. A wide adaptability is demonstrated specific to IC layout design. Ideas to handle a multilayer, nonrectangular chips with L-shaped modules are suggested.
Shigetoshi Nakatake, Kunihiro Fujiyoshi, Hiroshi Murata, Yoji Kajitani
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2
1997 A mapping from sequence-pair to rectangular dissection
abstract
A fundamental issue in floorplanning is in how to represent candidate solutions. A representation called sequence-pair was recently proposed. Seq-pair is so general as to represent an area minimum placement, and also efficient because it does not represent any overlapping placement. However, seq-pair is not expressive enough since channels are not represented. The paper gives a mapping from seq-pair to rectangular dissection, which represents channels by line segments. Consequently, candidate arrangements of modules and channels are successfully represented with the generality and the efficiency inherited from the seq-pair.
Hiroshi Murata, Kunihiro Fujiyoshi, Tomomi Watanabe, Yoji Kajitani
ASP-DAC2
1997 VLSI/PCB placement with obstacles based on sequence-pair
abstract
Article VLSI/PCB placement with obstacles based on sequence-pair Share on Authors: H. Murata Japan Advanced Institute of Science and Technology, Japan Japan Advanced Institute of Science and Technology, JapanView Profile , K. Fujiyoshi Tokyo University of Agriculture and Technology, Japan Tokyo University of Agriculture and Technology, JapanView Profile , M. Kaneko Japan Advanced Institute of Science and Technology, Japan Japan Advanced Institute of Science and Technology, JapanView Profile Authors Info & Claims ISPD '97: Proceedings of the 1997 international symposium on Physical designApril 1997 Pages 26–31https://doi.org/10.1145/267665.267675Online:01 April 1997Publication History 38citation300DownloadsMetricsTotal Citations38Total Downloads300Last 12 Months7Last 6 weeks1 Get Citation AlertsNew Citation Alert added!This alert has been successfully added and will be sent to:You will be notified whenever a record that you have chosen has been cited.To manage your alert preferences, click on the button below.Manage my AlertsNew Citation Alert!Please log in to your account Save to BinderSave to BinderCreate a New BinderNameCancelCreateExport CitationPublisher SiteGet Access
Hiroshi Murata, Kunihiro Fujiyoshi, Mineo Kaneko
ISPD2
1997 Design of minimum and uniform bipartites for optimum connection blocks of FPGA
abstract
The design of optimum connection blocks of field programmable gate arrays (FPGA's) in number and in distribution of switches is formulated as a bipartite graph design problem and solved. A bipartite with vertex sets R and L (|R|/spl les/|L|) is called totally perfect if there is a perfect matching from L/sub s/ to R for any L/sub s//spl sub/L with |L/sub s/|/spl les/|R|. The difference of maximum and minimum degrees of the vertices in L or R is called the skew of the respective vertex set. The problem is to construct a minimum totally perfect bipartite graph with the minimum skew. The result shows that a method, biscattering, can construct such a matrix in O(|R|/spl times/|L|) time where the lower bound is attained for both skews. This construction also solves the problem of designing optimum direct-concentrators.
Kunihiro Fujiyoshi, Yoji Kajitani, Hiroshi Niitsu
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
1996 Module placement on BSG-structure and IC layout applications
abstract
A new method of packing rectangles (modules) is presented with applications to IC layout design. It is based on the bounded-sliceline grid (BSG) structure. The BSG dissects the plane into rooms associated with binary relations "right-to"and "above" such that any two rooms are uniquely in either relation. A packing is obtained through an assignment of modules on the BSG. Followed by physical realization BSG-PACK. A simulated annealing searches for a goon packing of all packings by changing the assignments. Experiments showed that hundreds of rectangles are easily packed in a small rectangle area (chip) with quite good quality in area efficiency. A wide adaptability is demonstrated specific to IC layout design. Remarkable examples are: the chip is not necessarily rectangle, L-shaped modules and modules which are allowed to partially overlap each other can be handled.
Shigetoshi Nakatake, Kunihiro Fujiyoshi, Hiroshi Murata, Yoji Kajitani
ICCAD2
1996 VLSI module placement based on rectangle-packing by the sequence-pair
abstract
The earliest and the most critical stage in VLSI layout design is the placement. The background is the rectangle packing problem: given a set of rectangular modules of arbitrary sizes, place them without overlap on a plane within a rectangle of minimum area. Since the variety of the packing is uncountably infinite, the key issue for successful optimization is the introduction of a finite solution space which includes an optimal solution. This paper proposes such a solution space where each packing is represented by a pair of module name sequences, called a sequence-pair. Searching this space by simulated annealing, hundreds of modules have been packed efficiently as demonstrated. For applications to VLSI layout, we attack the biggest MCNC benchmark ami49 with a conventional wiring area estimation method, and obtain a highly promising placement.
Hiroshi Murata, Kunihiro Fujiyoshi, Shigetoshi Nakatake, Yoji Kajitani
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2
1995 Rectangle-packing-based module placement
abstract
The first and the most critical stage in VLSI layout design is the placement, the background of which is the rectangle packing problem: Given many rectangular modules of arbitrary site, place them without overlapping on a layer in the smallest bounding rectangle. Since the variety of the packing is infinite (two-dimensionally continuous) many, the key issue for successful optimization is in the introduction of a P-admissible solution space, which is a finite set of solutions at least one of which is optimal. This paper proposes such a solution space where each packing is represented by a pair of module name sequences. Searching this space by simulated annealing, hundreds of modules could be successfully packed as demonstrated. Combining a conventional wiring method, the biggest MCNC benchmark ami49 is challenged.
Hiroshi Murata, Kunihiro Fujiyoshi, Shigetoshi Nakatake, Yoji Kajitani
ICCAD2
1994 The Totally-Perfect Bipartite Graph and Its Construction
Kunihiro Fujiyoshi, Yoji Kajitani, Hiroshi Niitsu
ISAAC1
1994 Design of Optimum Totally Perfect Connection-Blocks of FPGA
abstract
The optimal design problem of the connection-blocks of FPGA with respect to the number of switches and their distribution is solved. This also concerns with the optimal construction of direct concentrators.>
Kunihiro Fujiyoshi, Yoji Kajitani, Hiroshi Niitsu
ISCAS1