This paper describes a unique fully automatic chip compiler, HAPPI, that uses double-level-metal technology and 3 levels of interconnection to realize high-speed and maximum-density chip designs consisting of a varying mixture of custom and standard-cell macros within a chip topology that guarantees 100% signal and power routing. A heuristic technique for generating placements of “soft macros” that are balanced in both area and connectivity has been presented. A routing approach that uses three level interconnection to guarantee 100% signal routing at no more than maximum density +1 tracks for channels is described, as well as a method for distributing power inside the chip in two-level metal. Finally, results of chip design using the HAPPI compiler have been presented.