Physics-informed neural networks (PINNs) have emerged as a promising framework to develop complex scientific surrogate models, yet their scalability and accuracy often degrade in non-canonical geometries, such as non-rectangular domains or three-dimensional (3D) domains with high aspect ratios. These limitations hinder the broader adoption of vanilla PINNs in real-world, practical systems. In this work, we introduce a multi-domain PINN (MDPINN) framework designed to address the scalability and generalization challenges inherent in 3D non-rectangular domains governed by nonlinear fluid dynamics. The target domain consists of intersecting 3D fluid channels with a high aspect ratio, inducing complex flow features such as deflections, mixing, and recirculations. Our approach is grounded in two key innovations: 1) domain decomposition, which partitions the channel volumes into multiple cubic-like subdomains, each modeled by an individual PINN, 2) enforcement of global dynamics (MDPINN-GD), which ensures that the total mass flow rate entering the domain equals that exiting. These innovations reduce the complexity of the problem imposed on individual PINNs and guide effective network optimization toward physically consistent solutions throughout the domain. We demonstrate that our method achieves: 1) 74.8\% accuracy improvement over a single-network PINN, and 2) 52.9\% accuracy improvement over MDPINN that do not enforce global mass conservation. Furthermore, the MDPINN-GD framework exhibits accurate prediction even in highly complex regions-such as the channel intersecting zone and the outlet zone characterized by intense flow mixing and large velocity gradients-achieving maximum normalized mean absolute errors below 14.9\% for velocity predictions compared to simulation results. This work establishes a path towards scalable, physically grounded surrogate modeling approach that is extensible to multiphysics and high-dimensional scientific problems.

Advanced semiconductor packaging is now used by semiconductors companies to meet both cost and performance requirements (e.g. bandwidth, latency, power, etc.) for artificial intelligence (AI) applications using heterogeneous multi-chiplet architectures. These packaging techniques include flip-chip, wafer-level packaging (both fan-in and fan-out) and 3D-Heterogeneous Integration (3D-HI) using package-on-package and hybrid/direct bonding. As detailed in several packaging roadmaps, chip-package-board co-design supported by multi-physics modeling and analysis are key underpinning technologies to support heterogeneous architectures that combine multi-chiplets within a single package.

Physically Unclonable Functions (PUFs) are used to provide identification, authentication and secret key generation based on unique and unpredictable physical characteristics. Carbon Nanotube Field Effect Transistors (CNFETs) were shown to have excellent electrical and unique physical characteristics and are promising candidates to replace silicon transistors in future Very Large Scale Integration (VLSI) designs. We present Carbon Nanotube PUF (CNPUF), the first PUF design that takes advantage of unique CNFET characteristics. CNPUF achieves higher reliability against environmental variations and increased resistance against modeling attacks. Furthermore, CNPUF has a considerable power and energy reduction in comparison to previous ultra-low power PUF designs of 89.6% and 98%, respectively. Additionally, CNPUF allows power-security tradeoff.