Erwin Liu

dblp:92/1794 · DBLP profile ↗
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2ranked-venue papers
0as first author
0since 2021 · last 1991
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 100%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › physical design
layout compaction
0.021991
A Two-Dimensional Topological Compactor With Octagonal Geometry · DAC 1991
Two-dimensional IC layout compaction based on topological design rule checking · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990
Electronic design automation
physical design
0.021991
A Two-Dimensional Topological Compactor With Octagonal Geometry · DAC 1991
Two-dimensional IC layout compaction based on topological design rule checking · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990
Electronic design automation › physical design › layout verification
design rule checking
0.011990
Two-dimensional IC layout compaction based on topological design rule checking · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990

Methods — techniques the papers use, named apart from their topics

wire minimization · 0.0iterative greedy optimization · 0.0topological design rule checking · 0.0bubble representation · 0.0
YearPublicationVenuePosition
1991 A Two-Dimensional Topological Compactor With Octagonal Geometry
abstract
We present a two-dimensional layout compactor with octagonal geometry.We discuss layout optimization algorithms used within a topological framework.We present the results of comparing the compactor against a standard set of benchmarks.This version of the compactor uses an iterative greedy layout optimization algorithm with wire minimization and produces leafcells more compact than others published.
Paul de Dood, John Wawrzynek, Erwin Liu, Roberto Suaya
DAC3
1990 Two-dimensional IC layout compaction based on topological design rule checking
abstract
An effective approach to two-dimensional compaction of VLSI circuit layouts is discussed. Active devices are described in terms of circular primitives called bubbles. The wires are treated topologically in that no geometric representation is used for them during compaction. This avoids expensive geometrical manipulations of the wires. Cells are compacted by moving bubbles one at a time along design rule preserving paths so as to minimize a cost function directly related to the size of the cell. Geometrical realizations of the wires are reconstructed at the end of the compaction process. The resulting routing has minimum wire length for each wire.>
John Valainis, Sinan Kaptanoglu, Erwin Liu, Roberto Suaya
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3