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M. B. Anand

dblp:92/6597 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 1998
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 50% Electronic design automation · 50%

Topics — the 2 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
design technology co-optimization
0.011998
Multiobjective optimization of VLSI interconnect parameters · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998
Integrated circuit design › interconnect
VLSI interconnect
0.011998
Multiobjective optimization of VLSI interconnect parameters · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1998

Methods — techniques the papers use, named apart from their topics

multi-objective optimization · 0.0critical path modeling · 0.0
YearPublicationVenuePosition
1998 Multiobjective optimization of VLSI interconnect parameters
abstract
The significant role played by interconnects in determining the speed and chip size of very-large-scale integrated circuits (VLSI) necessitates the development of new processes and tools for almost every device generation. Since such development usually requires lead times of several years, it has become essential to know, several years in advance, the various interconnect parameters for a particular generation. In this paper, a tool for optimizing interconnect parameters is presented. The formulation of an optimization problem that can be solved using standard algorithms is shown to be possible, and the optimization results obtained for future device generations are discussed. These results can be used to construct an interconnect technology roadmap. Last, shortcomings of and possible improvements to existing system-level critical path models are discussed.
M. B. Anand, Hideki Shibata, Masakazu Kakumu
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1