Demo Data from EDBT 2026 / reviewers in the wild / expert
Zhiwei Yin
dblp:98/8197
· DBLP profile ↗
2ranked-venue papers
0as first author
1since 2021 · last 2024
0000-0002-3883-7354ORCID · reported
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer graphics and multimedia
1 paper |
Computational fabrication · 100% | |
| Computer networks
1 paper |
Cellular and mobile networks · 100% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Computational fabrication › additive manufacturing
4d printing |
0.8 | 1 | 2024 | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation · Proc. IEEE 2024 |
Computational fabrication
additive manufacturing |
0.8 | 1 | 2024 | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation · Proc. IEEE 2024 |
Computational fabrication
origami-inspired fabrication |
0.8 | 1 | 2024 | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation · Proc. IEEE 2024 |
Cellular and mobile networks
next-generation wireless |
0.2 | 1 | 2024 | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation · Proc. IEEE 2024 |
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2024 | A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and ImplementationabstractEmerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing. Yang Yang 0034, Zhiwei Yin, Xuyi Zhu, Hani Al Jamal, Xiaojing Lv, Marvin Joshi, Nathan Wille, Mengze Li 0005, Shlomo Magdassi, Manos M. Tentzeris |
Proc. IEEE | 2 |
| 2009 | Handover Study Concerning Mobility in the Two-Hierarchy NetworkabstractFemtocell is an emerging technology aiming for a better indoor coverage. Due to its low costs, high grade of service, promotion of fixed-mobile convergence (FMC) and no change of core network, it has drawn close attention from the standardization organizations and the industrial field. In the two-hierarchy networks composed of traditional macro cellular networks and the embedded femtocell hotspots, moving mobiles will face up to the continual handovers when they pass along buildings. In this paper, handover algorithms considering signal strength and velocity are proposed using the mathematics concept of "set". Different handover methods are discussed and simulated. The results show that the proposed algorithms can obviously cut down unnecessary handovers compared with conventional soft handover on the same handover signal level limit. What's more, throughput of high speed mobiles and the total throughput of macro base station are increased. Shaohong Wu, Xin Zhang 0001, Ruiming Zheng, Zhiwei Yin, Yinglong Fang, Dacheng Yang |
VTC Spring | 4 |